Semiconductor device having conducting pins and cooling member

Claim 1

A semiconductor device comprising: a. an electrically insulating support plate having oppositely disposed first and second major surfaces, said plate comprising an aperture; b. a pattern of metal conductors disposed completely at said first major surface; c. current supply pins mounted on said support plate and having at least one thereof extending completely therethrough so as to be accessible from said second surface, said pins projecting orthogonally in the same direction from said first major surface, said pins being electrically and mechanically connected directly to respective parts of said metal conductors and extending a substantial distance from said first major surface so as to be available for making external electrical connections to said metal conductors; d. a semiconductor body comprising contact places, said semiconductor body being disposed in said plate aperture; e. a flexible electrically insulating foil of synthetic material; f. metal conductor tracks disposed on a first foil face and individually defining proximate and distal end portions, said distal end portions beiNg spaced closer to the periphery of said foil, said semiconductor body being mounted on said foil with its contact places being disposed on and in electrical contact with respective proximate end portions of said metal conductor tracks, said foil being disposed on said first major surface and lying wholly between the pins with the distal end portions being disposed on and in electrical contact with respective ones of said metal conductors and with the body being spaced from said second major surface, whereby said external electrical connections are made to said body and the opposite face of said foil is in overlying protective relationship to the body; and g. a cooling member connected to said support plate, said cooling member extending over at least a part of said second major surface of said support plate and comprising a projecting part which extends into said aperture of said support plate and engages the rear side of the semiconductor body in thermally conductive fashion.