Abstract 1. A dielectric lamina formed from a dielectric composition, said composition comprising: (a) about 60-40% of weight of a lead barium borosilicate glass binder having an average particle size of about 1.0-9.0 microns which is useful as a dielectric binder material in microelectronic devices and which is capable of being substantially saturated by a ceramic powder; and (b) about 60-40% by weight of a ceramic powder selected from the group consisting of ZrO2, Al2O3, TiO2, the zirconium silicates, and devitrified glass particles, and having an average particle size of about 1-10 microns; the amount and particle size of said glass binder and ceramic powder being correlated such that the ceramic powder substantially saturates the glass binder in that insufficient glass binder remains in unsaturated form to wet the surfaces of a solderable conductor when said conductor is heat-sealed thereto at about at least the temperature at which the dielectric composition is fired and the dielectric lamina formed from said composition is substantially free from pinholes and cracks, said dielectric lamina exhibiting a dielectric constant of about 4-7 at a 2 mil thickness, and a dielectric strength of greater than about 1000 volts/mil, when said lamina is formed by firing it at a temperature of 800-1000 degree C. for about 5-15 minutes.
A dielectric lamina formed from a dielectric composition, said composition comprising: (a) about 60-40% of weight of a lead barium borosilicate glass binder having an average particle size of about 1.0-9.0 microns which is useful as a dielectric binder material in microelectronic devices and which is capable of being substantially saturated by a ceramic powder; and (b) about 60-40% by weight of a ceramic powder selected from the group consisting of ZrO2, Al2O3, TiO2, the zirconium silicates, and devitrified glass particles, and having an average particle size of about 1-10 microns; the amount and particle size of said glass binder and ceramic powder being correlated such that the ceramic powder substantially saturates the glass binder in that insufficient glass binder remains in unsaturated form to wet the surfaces of a solderable conductor when said conductor is heat-sealed thereto at about at least the temperature at which the dielectric composition is fired and the dielectric lamina formed from said composition is substantially free from pinholes and cracks, said dielectric lamina exhibiting a dielectric constant of about 4-7 at a 2 mil thickness, and a dielectric strength of greater than about 1000 volts/mil, when said lamina is formed by firing it at a temperature of 800-1000 degree C. for about 5-15 minutes.
Claim 2
Dependent Claim
210 words
A dielectric lamina formed from a dielectric composition, said composition comprising: (a) about 60-40% of weight of a lead barium borosilicate glass binder having an average particle size of about 1.0-9.0 microns which is useful as a dielectric binder material in microelectronic devices and which is capable of being substantially saturated by a ceramic powder; and (b) about 60-40% by weight of a ceramic powder selected from the group consisting of ZrO2, Al2O3, TiO2, the zirconium silicates, and devitrified glass particles, and having an average particle size of about 1-10 microns; the amount and particle size of said glass binder and ceramic powder being correlated such that the ceramic powder substantially saturates the glass binder in that insufficient glass binder remains in unsaturated form to wet the surfaces of a solderable conductor when said conductor is heat-sealed thereto at about at least the temperature at which the dielectric composition is fired and the dielectric lamina formed from said composition is substantially free from pinholes and cracks, said dielectric lamina exhibiting a dielectric constant of about 4-7 at a 2 mil thickness, and a dielectric strength of greater than about 1000 volts/mil, when said lamina is formed by firing it at a temperature of 800-1000 degree C. for about 5-15 minutes.