Abstract 1. A METHOD FOR PREPARING A PRINTED CIRCUIT BOARD WITH IMPROVED ADHESION BETWEEN THE CONDUCTOR METAL AND A NONCONDUCTIVE SUBSTRATE COMPRISING THE STEPS OF: (A) PRECLEANING A SHEET OF ALUMINUM FOIL IN A SODIUM HYDROXIDE (NAOH) SOLUTION, (B) RINSING THE ALUMINUM FOIL IN WATER, (C) TREATING THE ALUMINUM FOIL IN A 50% SOLUTION OF NITRIC ACID (HNO3), (D) RINSING THE ALUMINUM FOIL IN WATER, (E) TREATING THE ALUMINUM FOIL IN A SOLUTION OF ZINC OXIDE (ZNO), CUPRIC OXIDE (CUO), AND SODIUM HYDROXIDE (NAOH), (F) RINSE IN DE-IONIZED WATER, (G) DRY THE ALUMINUM FOIL, (H) LAMINATE THE TREATED ALUMINUM FOIL TO A DIELECTRIC SUBSTRATE MATERIAL, (I) REMOVE ZINC AND ALUMINUM FROM THE SUBSTRATE BY IMMERSION IN AN ETHCHING BATH, (J) CATALYZE THE SUBSTRATE FOR ELECTROLESS METAL DEPOSITION, AND (K) ELECTROLESS PLATE THE CATALYZED SUBSTRATE WITH CONDUCTIVE METAL TO THE DESIRED THICKNESS.
A METHOD FOR PREPARING A PRINTED CIRCUIT BOARD WITH IMPROVED ADHESION BETWEEN THE CONDUCTOR METAL AND A NONCONDUCTIVE SUBSTRATE COMPRISING THE STEPS OF: (A) PRECLEANING A SHEET OF ALUMINUM FOIL IN A SODIUM HYDROXIDE (NAOH) SOLUTION, (B) RINSING THE ALUMINUM FOIL IN WATER, (C) TREATING THE ALUMINUM FOIL IN A 50% SOLUTION OF NITRIC ACID (HNO3), (D) RINSING THE ALUMINUM FOIL IN WATER, (E) TREATING THE ALUMINUM FOIL IN A SOLUTION OF ZINC OXIDE (ZNO), CUPRIC OXIDE (CUO), AND SODIUM HYDROXIDE (NAOH), (F) RINSE IN DE-IONIZED WATER, (G) DRY THE ALUMINUM FOIL, (H) LAMINATE THE TREATED ALUMINUM FOIL TO A DIELECTRIC SUBSTRATE MATERIAL, (I) REMOVE ZINC AND ALUMINUM FROM THE SUBSTRATE BY IMMERSION IN AN ETHCHING BATH, (J) CATALYZE THE SUBSTRATE FOR ELECTROLESS METAL DEPOSITION, AND (K) ELECTROLESS PLATE THE CATALYZED SUBSTRATE WITH CONDUCTIVE METAL TO THE DESIRED THICKNESS.
Claim 2
Independent Claim
139 words
A METHOD FOR PREPARING A PRINTED CIRCUIT BOARD WITH IMPROVED ADHESION BETWEEN THE CONDUCTOR METAL AND A NONCONDUCTIVE SUBSTRATE COMPRISING THE STEPS OF: (A) PRECLEANING A SHEET OF ALUMINUM FOIL IN A SODIUM HYDROXIDE (NAOH) SOLUTION, (B) RINSING THE ALUMINUM FOIL IN WATER, (C) TREATING THE ALUMINUM FOIL IN A 50% SOLUTION OF NITRIC ACID (HNO3), (D) RINSING THE ALUMINUM FOIL IN WATER, (E) TREATING THE ALUMINUM FOIL IN A SOLUTION OF ZINC OXIDE (ZNO), CUPRIC OXIDE (CUO), AND SODIUM HYDROXIDE (NAOH), (F) RINSE IN DE-IONIZED WATER, (G) DRY THE ALUMINUM FOIL, (H) LAMINATE THE TREATED ALUMINUM FOIL TO A DIELECTRIC SUBSTRATE MATERIAL, (I) REMOVE ZINC AND ALUMINUM FROM THE SUBSTRATE BY IMMERSION IN AN ETHCHING BATH, (J) CATALYZE THE SUBSTRATE FOR ELECTROLESS METAL DEPOSITION, AND (K) ELECTROLESS PLATE THE CATALYZED SUBSTRATE WITH CONDUCTIVE METAL TO THE DESIRED THICKNESS.