US3836697A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High current interconnection assembly in a microcircuit package
Assignee: General Electric Co
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Filing: 1971-04-21
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Granted: 1974-09-17
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Expires: 1991-04-21
Abstract
Abstract A high current interconnection is provided in a microcircuit package comprising first and second contacts each bonded to a substrate mounted in a package interconnected by a high current wire. The contacts are discrete pads of beryllium oxide and the high current wire is formed of Nichrome which is welded at its ends to a conductive surface layer provided on each pad. The wire is bowed away from the substrate for thermal stress relief.
Inventors
- 👤 W Schultz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 11:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K3/4015; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07552; H10W72/50; H10W72/521; H10W72/527; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/753
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
104 words
Apparatus for providing a high current conduction path for microcircuit elements mounted on a base substrate comprising, in combination: a pair of spaced-apart discrete beryllium oxide pads bonded to said base with a thermally conductive bonding material; a layer of electrically conductive material provided on the surface of said pads opposite said bonded Surface; a wire of relatively high electrical conductivity welded at each end to the respective conduction surfaces of said pads and bowed upwardly away from said base to provide thermal stress relief; and conduction means connected to the conductive surfaces of said pads for coupling current to and from said apparatus.
Claim 2
Dependent Claim
104 words
Apparatus for providing a high current conduction path for microcircuit elements mounted on a base substrate comprising, in combination: a pair of spaced-apart discrete beryllium oxide pads bonded to said base with a thermally conductive bonding material; a layer of electrically conductive material provided on the surface of said pads opposite said bonded Surface; a wire of relatively high electrical conductivity welded at each end to the respective conduction surfaces of said pads and bowed upwardly away from said base to provide thermal stress relief; and conduction means connected to the conductive surfaces of said pads for coupling current to and from said apparatus.
References Cited (Backward Citations)
US3619734A
Cited
US3711778A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-09-16 | 1978-03-18 | 1978-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-09-16 | 1982-03-18 | 1982-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-09-16 | 1986-03-18 | 1986-09-17 | $7700.00 | Window Closed / Lapsed |