Encapsulation for light-emitting diodes
Abstract
Abstract AN OPTICAL SEMICONDUCTOR DEVICE INCLUDING AN ELECTROUMINESCENT DIODE MOUNTED ON A SUPPORT SO THAT RADIATION FROM THE DIODE IS EMITTED AWAY FROM THE SUPPORT. A GLASS DOME IS MOUNTED ON THE SUPPORT AND COVERS THE DIODE SO AS TO BE IN INTIMATE CONTACT WITH THE DIODE. THE RADIATION EMITTED FROM THE DIODE PASSES THROUGH THE GLASS DOME SO AS TO IMPROVE THE EXTERNAL EMISSION EFFICIENCY OF THE DEVICE. THE OPTICAL SEMICONDUCTOR DEVICE IS MADE BY MOUNTING THE ELECTROLUMINESCENT DIODE ON A SUPPORT AND THEN FORMING A GLASS DOME OVER THE DIODE WITH THE DOME BEING IN INTIMATE CONTACT WITH AND FUSED TO THE DIODE, THE GLASS DOME BEING FORMED OF A TRANSLUCENT PARTIALLY DEVETRIFIED PHASE-SEPARATED CHALOGENIDE GLASS FROM THE AS-BR-S SYSTEM. THE TRANSLUCENT CHALOGENIDE GLASS IS PREPARED IN EVACUATED SEALED AMPOULES AND AFTER BEING APPLIED TO THE DIODE THE GLASS IS HEATED TO ENHANCE THE PHASESEPARATION PROCESS.
Inventors
- 👤 R Klein
Bibliographic Details
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