Hermetically sealed mounting structure for miniature electronic circuitry

Claim 1

A mounting and hermetically sealing and encapsuling structure for miniature electronic circuit elements, which are supported on ceramic carrier wafers or the like, comprising: a base element made of a material of high thermal conductance to serve as heat sink and having a mounting platform, the electronic circuit elements being disposed on the mounting platform; the base element further having an integral, flat bar along one side and between the end portions of the base element, the flat bar having windows; current lead-in support members in the windows each comprised of a ceramic wafer element with peripheral metallization on one side respectively being sealed to the material of the base element where defining the respective window, each member having at least one metallized aperture, there being first, externally accessible metal current leads in the apertures connected to terminals of the electronic circuit elements as disposed on the mounting platform, the one side of the each wafer provided with a metallization island around the respective aperture in the wafer, the respective first, metal lead in the aperture connected to the metallization island; a second external lead on the other side of the wafer and being cemented thereto as well as connected to the first lead in the aperture of the wafer; the second external lead, the first metal lead in the aperture, the metallization lining and the island providing an electric signal path through metallic contact between them and establishing metallic sealing from one side of the wafer element to the other side; and a cover sealingly connected to the base element.