US3825164A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for soldering printed circuit cards
Assignee: International Business Machines Corp
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Filing: 1972-12-11
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Granted: 1974-07-23
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Expires: 1992-12-11
Abstract
Abstract A method and apparatus for soldering component devices to a printed circuit card or board by immersing an assembled printed circuit card into a tank of a controllably heated fluxing composition or bath wherein the assembly is preheated to a suitable temperature. A pumping apparatus is applied to a pool of molten solder residing at the bottom of the tank to cause the solder to flow upwardly through a piping system and exit an orifice or plurality of orifices extending transversely of the direction of movement of the printed circuit card assembly. The solder spray system is immersed in the bath and creates a wall of molten solder which is impinged against the printed circuit card to effectively join the components to the printed circuit card as the card is being uniformly withdrawn from the tank at a controlled movement rate.
Inventors
- 👤 F Sarnacki
- 👤 R Steenstrup
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 04:01
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0653; B23K2101/00; B23K2101/36; B23K2101/42; H05K2203/00; H05K2203/07; H05K2203/0736; H05K2203/0746; H05K2203/0756; H05K2203/0776; H05K2203/15; H05K2203/1518; H05K3/3489
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
157 words
Apparatus for soldering component parts to printed circuit cards comprising, in combination: a. a container having molten solder at the bottom thereof, b. a liquid fluxing solution disposed within the container and overlying the molten solder, c. heating means associated with said container for maintaining said solder and fluxing solution at a predetermined temperature, d. solder spraying apparatus disposed within said fluxing solution, e. a carrier fixture for a printed circuit card having parts thereon to be connected by solder, f. means for moving said carrier fixture into and out of the fluxing solution at a predetermined rate and past said solder spraying apparatus, and g. means for pumping the molten solder from the bottom of said container to said solder spraying apparatus for impinging a solder spray against the surface of the printed circuit card as it is moved past the solder spraying apparatus whereby the parts and areas to be joined are connected by solder.
Claim 2
Dependent Claim
157 words
Apparatus for soldering component parts to printed circuit cards comprising, in combination: a. a container having molten solder at the bottom thereof, b. a liquid fluxing solution disposed within the container and overlying the molten solder, c. heating means associated with said container for maintaining said solder and fluxing solution at a predetermined temperature, d. solder spraying apparatus disposed within said fluxing solution, e. a carrier fixture for a printed circuit card having parts thereon to be connected by solder, f. means for moving said carrier fixture into and out of the fluxing solution at a predetermined rate and past said solder spraying apparatus, and g. means for pumping the molten solder from the bottom of said container to said solder spraying apparatus for impinging a solder spray against the surface of the printed circuit card as it is moved past the solder spraying apparatus whereby the parts and areas to be joined are connected by solder.
Claim 3
Dependent Claim
187 words
Apparatus for soldering component parts to printed circuit cards comprising: a. a tank having a reservoir of a molten relatively low melting point solder disposed at the bottom of the tank, b. a liquid fluxing solution disposed within the tank and overlying the molten solder, c. heating means disposed about the walls of said tank and operative for maintaining the temperature of said molten solder and said fluxing solution at predetermined temperatures, d. a system of solder spraying apparatus including a plurality of nozzles having orifices therein disposed within said liquid fluxing solution, e. a carrier fixture for supporting a printed circuit card having parts thereon to be connected, f. means for moving said carrier fixture vertically into and out of the liquid fluxing solution at a predetermineD rate, and g. means for pumping the molten solder from the bottom of said tank to said solder spraying system for impinging a solder spray against the surface of the printed circuit card as it is moved past the solder spraying apparatus whereby the parts and areas of the printed circuit card to be joined are connected by solder.
Claim 4
Dependent Claim
187 words
Apparatus for soldering component parts to printed circuit cards comprising: a. a tank having a reservoir of a molten relatively low melting point solder disposed at the bottom of the tank, b. a liquid fluxing solution disposed within the tank and overlying the molten solder, c. heating means disposed about the walls of said tank and operative for maintaining the temperature of said molten solder and said fluxing solution at predetermined temperatures, d. a system of solder spraying apparatus including a plurality of nozzles having orifices therein disposed within said liquid fluxing solution, e. a carrier fixture for supporting a printed circuit card having parts thereon to be connected, f. means for moving said carrier fixture vertically into and out of the liquid fluxing solution at a predetermineD rate, and g. means for pumping the molten solder from the bottom of said tank to said solder spraying system for impinging a solder spray against the surface of the printed circuit card as it is moved past the solder spraying apparatus whereby the parts and areas of the printed circuit card to be joined are connected by solder.
Claim 5
Dependent Claim
185 words
Apparatus for soldering component parts to printed circuit cards comprising: a. a tank having a reservoir of a molten relatively low melting point solder disposed at the bottom of the tank, b. a liquid fluxing solution disposed within the tank and overlying the molten solder, c. heating means disposed within the walls of said tank, d. temperature control means operative for maintaining said molten solder and said fluxing solution at predetermined temperatures, e. solder spraying apparatus including at least one nozzle having an orifice therein disposed within said liquid fluxing solution, f. a carrier fixture for supporting a printed circuit card having parts thereon to be connected, g. means for moving said carrier fixture vertically into and out of the liquid fluxing solution at a predetermined rate, and h. means for pumping the molten solder from the bottom of said tank to said solder spraying system for impinging a solder spray against the surface of the printed cirucit card as it is moved past the solder spraying apparatus whereby the parts and areas of the printed circuit card to be joined are connected by solder.
Claim 6
Dependent Claim
185 words
Apparatus for soldering component parts to printed circuit cards comprising: a. a tank having a reservoir of a molten relatively low melting point solder disposed at the bottom of the tank, b. a liquid fluxing solution disposed within the tank and overlying the molten solder, c. heating means disposed within the walls of said tank, d. temperature control means operative for maintaining said molten solder and said fluxing solution at predetermined temperatures, e. solder spraying apparatus including at least one nozzle having an orifice therein disposed within said liquid fluxing solution, f. a carrier fixture for supporting a printed circuit card having parts thereon to be connected, g. means for moving said carrier fixture vertically into and out of the liquid fluxing solution at a predetermined rate, and h. means for pumping the molten solder from the bottom of said tank to said solder spraying system for impinging a solder spray against the surface of the printed cirucit card as it is moved past the solder spraying apparatus whereby the parts and areas of the printed circuit card to be joined are connected by solder.
Claim 7
Dependent Claim
201 words
Apparatus for soldering component parts to printed circuit cards comprising: a. a tank having a reservoir of a molten relatively low melting point solder disposed at the bottom of the tank, b. a liquid fluxing solution disposed within the tank and overlying the molten solder, c. heating means disposed peripherally about said tank and operative for maintaining the temperature of said molten solder and said fluxing solution at predetermined temperatures, d. a system of solder spraying apparatus including a plurality of nozzles having orifices therein disposed immediately beneath the surface of said liquid fluxing solution, e. a carrier fixture for supporting a printed circuit card having parts thereon to be connected, f. means for moving said carrier fixture vertically into and out of the liquid fluxing solution and in the vicinity of said solder spraying apparatus at a predetermined rate, and g. pumping means for conveying the molten solder from the bottom of said tank to said solder spraying system for impinging a solder spray against the surface of the printed circuit card as it is moved in front of the solder spraying apparatus whereby the parts and areas of the printed circuit card to be joined are connected by solder.
Claim 8
Dependent Claim
201 words
Apparatus for soldering component parts to printed circuit cards comprising: a. a tank having a reservoir of a molten relatively low melting point solder disposed at the bottom of the tank, b. a liquid fluxing solution disposed within the tank and overlying the molten solder, c. heating means disposed peripherally about said tank and operative for maintaining the temperature of said molten solder and said fluxing solution at predetermined temperatures, d. a system of solder spraying apparatus including a plurality of nozzles having orifices therein disposed immediately beneath the surface of said liquid fluxing solution, e. a carrier fixture for supporting a printed circuit card having parts thereon to be connected, f. means for moving said carrier fixture vertically into and out of the liquid fluxing solution and in the vicinity of said solder spraying apparatus at a predetermined rate, and g. pumping means for conveying the molten solder from the bottom of said tank to said solder spraying system for impinging a solder spray against the surface of the printed circuit card as it is moved in front of the solder spraying apparatus whereby the parts and areas of the printed circuit card to be joined are connected by solder.
Claim 9
Dependent Claim
37 words
Apparatus for soldering component parts to printed circuit cards as defined in claim 4 wherein the temperature for the molten solder and fluxing solution are maintained at approximately 30* F. above the melting point of the solder.
Claim 10
Dependent Claim
44 words
Apparatus for soldering component parts to printed circuit cards as defined in claim 4 wherein the carrier fixture is adapted to move the printed circuit card past the nozzles of the solder spraying apparatus at a distance of from 0.5 inch to 2.0 inches.
Claim 11
Dependent Claim
45 words
Apparatus for soldering component parts to printed circuit cards as defined in claim 4 wherein the carrier fixture is adapted to move the printed circuit card past the nozzles of the solder spraying apparatus at a rate of from 2 to 7 feet per minute.
Claim 12
Dependent Claim
37 words
Apparatus for soldering component parts to printed circuit cards as defined in claim 4 wherein the pumping means for conveying the molten solder operates in a pressure range of from 5 to 10 pounds per square inch.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-07-22 | 1978-01-21 | 1978-07-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-07-22 | 1982-01-21 | 1982-07-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-07-22 | 1986-01-21 | 1986-07-23 | $7700.00 | Window Closed / Lapsed |