Abstract A semiconductor package having a metallized fugitive shorting bar across the conductor pads or leads to prevent electrical damage to a semiconductor chip, inserted therein, from static electricity discharges, and a process for packaging a semiconductor chip and removing the shorting bar by solder leaching are provided. The shorting bar is screen printed as a thick-film metallized strip or bar across the conductor lead attach pads or lead frame of the semiconductor package. After a semiconductor chip is inserted in the package by the semiconductor manufacturer and the chip attached and sealed, the shorting bar may be removed at the same time the leads are soldered to the package by the solder leaching properties of a tin-lead-silver or tin-lead solder. Silver is the preferred material of the shorting bar since it is readily compatible with tin-lead-silver or tin-lead solder. However, gold, tin, lead or any thick film material readily dissolved or leached by the solder may be used.
In a semiconductor electronic circuit package, comprising a substrate having conductor patterns thereon and conductor pads connected to said conductor pattern, the improvement comprising fugitive shorting means on the substrate for electrically shorting said conductor pads during insertion of a semiconductor chip, said shorting means being removable by solder leaching.
Claim 2
Dependent Claim
50 words
In a semiconductor electronic circuit package, comprising a substrate having conductor patterns thereon and conductor pads connected to said conductor pattern, the improvement comprising fugitive shorting means on the substrate for electrically shorting said conductor pads during insertion of a semiconductor chip, said shorting means being removable by solder leaching.
Claim 3
Dependent Claim
22 words
A package according to claim 1, wherein said shorting means is a metallized strip disposed on said substrate overlaying said conductor pads.
Claim 4
Dependent Claim
31 words
A package according to claim 2, wherein said substrate is rectangular and said strip is along the two lengthwise edges of said substrate and at least one end of said substrate.
Claim 5
Dependent Claim
14 words
A package according to claim 2, wherein said shorting means is a silver metallization.