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US3817784A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for coating substrates with copper by thermal decomposition of selected fluoroorganocopper (i) compounds

Assignee: EIDP Inc
•
Filing: 1972-05-09
•
Granted: 1974-06-18
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Expires: 1992-05-09
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Abstract

Abstract A PROCESS FOR COPPER-COATING VARIOUS SUBSTRATES AND A DESCRIPTION OF THE SUBSTRATES THAT ARE COATED. THE PROCESS COMPRISES SELECTED FLUOROORGANOCOPPER COMPOSITIONS AT PREFERRED TEMPERATURES OF ABOUT -20*C. TO 350*C. THE COPPER COATING ARE ELECTRICAL CONDUCTORS AND USEFUL, FOR INSTANCE, IN PRINTED CIRCUITS.

Inventors

  • 👤 A Cairncross
  • 👤 W Sheppard

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 11:55
CPC Classifications
C; C07; C07F; C07F1/00; C07F1/08; C23; C23C; C23C16/00; C23C16/06; C23C16/18; H; H05; H05K; H05K3/00; H05K3/10; H05K3/105

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-06-17 1977-12-17 1978-06-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-06-17 1981-12-17 1982-06-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-06-17 1985-12-17 1986-06-18 $7700.00 Window Closed / Lapsed

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