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US3814641A Expired / Lapsed US ⏱️ 0.0 years remaining

Process of fabricating silicon photomask

Assignee: INSTR Inc
•
Filing: 1972-07-20
•
Granted: 1974-06-04
•
Expires: 1992-07-20
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Abstract

Abstract AN IMPROVED "SEE-THROUGH" PHOTOMASK OF SILICON PATTERNED ON GLASS IS PRODUCED BY THE LOW-TEMPERATURE DEPOSITION OF SILICON, FOLLOWED BY THE LOW-TEMPERATURE DEPOSITION OF SILICON NITRIDE OR SILICON OXIDE ON THE SILICON. THE NITRIDE OR OXIDE IS THEN PATTERNED BY SELECTIVE ETCHING FOR USE AS AN ETCH-RESISTANT MASK IN THE SELECTIVE ETCHING OF THE SILICON TO PRODUCE THE PHOTOMASK. PREFERABLY, THE NITRIDE OR OXIDE PATTERN IS LEFT ON THE SILICON PATTERN AS AN ANTI-REFLECTION COATING.

Inventors

  • 👤 A Reinberg
  • 👤 J Fish

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 18:37
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/50; Y; Y10; Y10S; Y10S148/00; Y10S148/051; Y10S148/085; Y10S148/106; Y10S148/15

Claims Analysis

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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-06-03 1977-12-03 1978-06-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-06-03 1981-12-03 1982-06-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-06-03 1985-12-03 1986-06-04 $7700.00 Window Closed / Lapsed

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