Composition and method of bonding gold to a ceramic substrate and a bonded gold article
Abstract
Abstract A COMPOSITION FOR, AS WELL AS A METHOD OF BONDING GOLD TO A CERAMIC AND A BONDED GOLD ARTICLE WHICH INCLUDES A COMPOSITION OF GOLD AND COPPER OXIDE FOR BONDING A GOLD LAYER TO A CERAMIC SUBSTRATE. GOLD POWDER AND COPPER OXIDE PARTICLES DEFINE A SOLID COMPOSITION MIXTURE WHEREIN THE COPPER OXIDE HAS A WEIGHT PERCENT IN THE PREFERRED REGION BETWEEN 1.2% AND 1.4%. ORGANIC BINDER IS ADDED TO THE PREDETERMINED AMOUNT OF COPPER OXIDE PARTICLES AND BLENDED. THE GOLD POWDER IS INCORPORATED INTO THE COPPER OXIDE AND ORGANIC BINDER TO FORM A TOTAL COMPOSITION MIXTURE. THE ORGANIC BINDER HAS A WEIGHT PERCENTAGE OF THE TOTAL COMPOSITION MIXTURE WITHIN THE PERFERRED RANGE OF 50% TO 85%. THE TOTAL COMPOSITION MIXTURE ID BLENDED AND APPLIED TO A CERAMIC SUBSTRATE. THE COATED CERAMIC ARTICLE IS FIRED WITHIN THE PERFERRED TEMPERATURE RANGE 1020* C. TO 1040* C. COPPER OXIDE CRYSTALS ARE FORMED WHICH IMPREGNATE THE CERAMIC SUBSTRATE AND FROM A HIGH STRENGTH BOND BETWEEN THE GOLD LAYER AND THE CERAMIC SUBSTRATE.
Inventors
- 👤 B Smith
Bibliographic Details
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