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US3798512A Expired / Lapsed US ⏱️ 0.0 years remaining

Fet device with guard ring and fabrication method therefor

Assignee: International Business Machines Corp
•
Filing: 1970-09-28
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Granted: 1974-03-19
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Expires: 1990-09-28
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Abstract

Abstract An N-channel FET device is provided with an N type guard ring to prevent surface leakage by an inversion layer formed at the surface of the FET device that is covered with an insulating layer. The guard ring is preferably an N+ diffused layer or region that surrounds the FET device. For integrated circuit applications where a plurality of FET devices are used, N+ guard rings either surround each device or a group of devices. The guard ring is electrically connnected to ground and the P type substrate is reverse biased thereby preventing surface leakage.

Inventors

  • 👤 D Critchlow
  • 👤 S Schuster

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 22:23
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/102; H10D62/112; H10D99/00

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 218 words
A semiconductor device having reduced surface leakage current, comprising: A semiconductor substrate of one conductivity type having portions of one surface coated with an insulating material which produce an inversion surface layer on said one surface which is of opposite conductivity type to the conductivity type of said substrate, a source region and a drain region of opposite conductivity type than said substrate, said source and drain regions being located in said one surface of said substrate, a gate electrode located over the region between said source and drain regions, potentials applied to said gate electrode affecting the conductivity of the region between said source and drain region, a guard means which is reverse-biased with respect to said substrate and is located around said source and drain regions and separate from said source for preventing surface current leakage from said source and drain regions, said guard means being located in said one surface and having the same conductivity type as said source and drain regions, bias means for applying potentials to said substrate and to said source and drain regions and to said guard means, said source and drain regions and said guard means being biased to prevent surface current leakage from said source and drain regions, said guard means being reverse biased with respect to said substrate.
Claim 2
Dependent Claim 218 words
A semiconductor device having reduced surface leakage current, comprising: A semiconductor substrate of one conductivity type having portions of one surface coated with an insulating material which produce an inversion surface layer on said one surface which is of opposite conductivity type to the conductivity type of said substrate, a source region and a drain region of opposite conductivity type than said substrate, said source and drain regions being located in said one surface of said substrate, a gate electrode located over the region between said source and drain regions, potentials applied to said gate electrode affecting the conductivity of the region between said source and drain region, a guard means which is reverse-biased with respect to said substrate and is located around said source and drain regions and separate from said source for preventing surface current leakage from said source and drain regions, said guard means being located in said one surface and having the same conductivity type as said source and drain regions, bias means for applying potentials to said substrate and to said source and drain regions and to said guard means, said source and drain regions and said guard means being biased to prevent surface current leakage from said source and drain regions, said guard means being reverse biased with respect to said substrate.
Claim 3
Dependent Claim 22 words
The device of claim 1, wherein said source and drain regions are of N-type conductivity and said substrate is of P-type conductivity.
Claim 4
Dependent Claim 22 words
The device of claim 1, where said source and drain regions are of P-type conductivity and said substrate is of N-type conductivity.
Claim 5
Dependent Claim 19 words
The device of claim 1, wherein said source and drain regions are reverse biased with respect to said substrate.
Claim 6
Dependent Claim 20 words
The semiconductor device of claim 1, where said substrate is silicon and said insulating material is a compound of silicon.
Claim 7
Dependent Claim 12 words
The semiconductor device of claim 1, where said insulating material comprises alumina.
Claim 8
Dependent Claim 26 words
The device of claim 1, where said source and drain regions, and said guard means are diffused regions located in said one surface of said substrate.

References Cited (Backward Citations)

US3076104A Cited
US3335296A Cited
US3400383A Cited
US3445924A Cited
US3427445A Cited
US3447046A Cited
US3502950A Cited
US3573509A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-03-18 1977-09-17 1978-03-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-03-18 1981-09-17 1982-03-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-03-18 1985-09-17 1986-03-19 $7700.00 Window Closed / Lapsed

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