US3798141A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Technique for electroetching thin film metallization
Assignee: AT&T Inc
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Filing: 1972-10-19
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Granted: 1974-03-19
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Expires: 1992-10-19
Abstract
Abstract PATTERN DELINEATION OF THIN FILM METALLIZATIONS INCLUDING GOLD, PLATINUM AND RHODIUM IS EFFECTED ELECTROLYTICALLY IN THE PRESENCE OF A STONG ACID HAVING A PH LESS THAN ONE. THE DESCRIBED TECHNIQUE PERMITS CONTROLLED ETCHING OF NOBLE METALS WHICH HERETOFORE HAVE BEEN ETCHED ONLY WITH DIFFICULTY. D R A W I N G
Inventors
- 👤 J Yahalom
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 21:13
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/07; C; C25; C25F; C25F3/00; C25F3/02; H10; H10N; H10N97/00; H10P; H10P95/00
Claims Analysis
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-03-18 | 1977-09-17 | 1978-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-03-18 | 1981-09-17 | 1982-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-03-18 | 1985-09-17 | 1986-03-19 | $7700.00 | Window Closed / Lapsed |