US3797100A — Soldering method and apparatus for ceramic circui…

Claim 1

Independent Claim 128 words

A method for soldering electronic components to a circuit board having conductor pads on an upper side thereof, comprising the steps of applying solder to a plurality of said conducting pads, positioning a corresponding plurality of electronic components respectively on said plurality of pads, and applying heat to a corresponding plurality of localized areas of the underside of the circuit board aligned respectively with said plurality of conductor pads, wherein said heat is applied by arranging a corresponding plurality of miniature gas discharge orifices in alignment with the respective localized areas, discharging gas from the orifices, and igniting the gas to provide a plurality of heating flames for heating said localized areas, whereby the heat is conducted through the circuit board to effect solder joints at said pads.

Claim 2

Independent Claim 128 words

A method for soldering electronic components to a circuit board having conductor pads on an upper side thereof, comprising the steps of applying solder to a plurality of said conducting pads, positioning a corresponding plurality of electronic components respectively on said plurality of pads, and applying heat to a corresponding plurality of localized areas of the underside of the circuit board aligned respectively with said plurality of conductor pads, wherein said heat is applied by arranging a corresponding plurality of miniature gas discharge orifices in alignment with the respective localized areas, discharging gas from the orifices, and igniting the gas to provide a plurality of heating flames for heating said localized areas, whereby the heat is conducted through the circuit board to effect solder joints at said pads.

Claim 3

Independent Claim 143 words

A method for soldering electronic components to a circuit board having conductor pads on an upper side thereof, comprising the steps of applying solder to a plurality of said conductor pads, positioning a corresponding plurality of electronic components respectively on said plurality of pads, conveying the circuit board along a predetermined path, arranging a plurality of miniature gas discharge orifices below the circuit board and along said predetermined path in a configuration wherein each conductor pad passes in alignment with at least one of the orifices, discharging gas from the orifices continuously while the circuit board is being conveyed, and igniting the gas to provide a plurality of heating flames, whereby localized areas of the underside of said circuit board are heated by said flames and said heat is conducted through the circuit board to effect solder joints at said plurality of pads.

Claim 4

Independent Claim 143 words

A method for soldering electronic components to a circuit board having conductor pads on an upper side thereof, comprising the steps of applying solder to a plurality of said conductor pads, positioning a corresponding plurality of electronic components respectively on said plurality of pads, conveying the circuit board along a predetermined path, arranging a plurality of miniature gas discharge orifices below the circuit board and along said predetermined path in a configuration wherein each conductor pad passes in alignment with at least one of the orifices, discharging gas from the orifices continuously while the circuit board is being conveyed, and igniting the gas to provide a plurality of heating flames, whereby localized areas of the underside of said circuit board are heated by said flames and said heat is conducted through the circuit board to effect solder joints at said plurality of pads.

Claim 5

Dependent Claim 160 words

In apparatus for soldering an electronic component to a circuit board, wherein the circuit board has a conductor pad on an upper side thereof, the component is placed on the pad, and solder is applied to the junction between the component and pad, an improvement comprising a wire grid and frame means for supporting the circuit board to provide an exposed area at the underside thereof and in alignment with the conductor pad portion, said frame means having the edges of said wire grid attached thereto, torch means having a miniature gas discharge orifice for disCharging gas for ignition to produce a flame, wherein said wire grid is suspended above said torch means for supporting said board thereon, wherein said torch means is aligned with said conductor pad, and wherein heat produced by said torch means is conducted through said circuit board to said conductor pad, at a localized area at the underside of said board, for melting said solder.

Claim 6

Dependent Claim 160 words

In apparatus for soldering an electronic component to a circuit board, wherein the circuit board has a conductor pad on an upper side thereof, the component is placed on the pad, and solder is applied to the junction between the component and pad, an improvement comprising a wire grid and frame means for supporting the circuit board to provide an exposed area at the underside thereof and in alignment with the conductor pad portion, said frame means having the edges of said wire grid attached thereto, torch means having a miniature gas discharge orifice for disCharging gas for ignition to produce a flame, wherein said wire grid is suspended above said torch means for supporting said board thereon, wherein said torch means is aligned with said conductor pad, and wherein heat produced by said torch means is conducted through said circuit board to said conductor pad, at a localized area at the underside of said board, for melting said solder.

Claim 7

Dependent Claim 171 words

In apparatus for soldering an electronic component to a circuit board, wherein the circuit board has a conductor pad on an upper side thereof, the component is placed on the pad, and solder is applied to the junction between the component and pad, an improvement comprising means for supporting the circuit board to provide an exposed area at the underside thereof and in alignment with the conductor pad portion, torch means having a miniature gas discharge opening disposed beneath the circuit board in a spaced relation therewith for discharging gas for ignition to produce a flame directed toward a localized area of said circuit board aligned with said pad, and control means connected to said torch means for actuation to cause a discharge of gas from said orifice and to automatically ignite said discharge of gas to produce said flame, whereby heat produced by said torch means is conducted through said circuit board from said localized area at the underside of said board to said conductor pad for melting said solder.

Claim 8

Dependent Claim 171 words

In apparatus for soldering an electronic component to a circuit board, wherein the circuit board has a conductor pad on an upper side thereof, the component is placed on the pad, and solder is applied to the junction between the component and pad, an improvement comprising means for supporting the circuit board to provide an exposed area at the underside thereof and in alignment with the conductor pad portion, torch means having a miniature gas discharge opening disposed beneath the circuit board in a spaced relation therewith for discharging gas for ignition to produce a flame directed toward a localized area of said circuit board aligned with said pad, and control means connected to said torch means for actuation to cause a discharge of gas from said orifice and to automatically ignite said discharge of gas to produce said flame, whereby heat produced by said torch means is conducted through said circuit board from said localized area at the underside of said board to said conductor pad for melting said solder.

Claim 9

Dependent Claim 87 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 4, in which said control means includes a valve connected to said torch means to control the flow of gas to said discharge orifice, a solenoid connected to said valve for actuating said valve in response to an electrical potential applied thereto, switch means for connection to a potential source, and means interconnecting said switch means and solenoid for operating said solenoid to open said valve after closure of said switch means.

Claim 10

Dependent Claim 68 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 5, in which said control means further includes an electrical heating filament disposed adjacent said discharge orifice, and means interconnecting said filament with said switch means for supplying a heating current to said filament upon closure of said switch means, whereby said filament is heated to ignite the gas at said discharge orifice.

Claim 11

Dependent Claim 83 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 6, in which said means interconnecting said filament and switch means includes first delay relay means having an energizing circuit connected to said switch means and having switching contacts connected for supplying current to said filament for a first predetermined period upon closure of said switch means, wherein said switching contacts open upon energization of said delay relay means to terminate the supply of current to said filament.

Claim 12

Dependent Claim 68 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 7, in which said means interconnecting said switch means and solenoid includes second delay relay means connected for energizing said solenoid for a second predetermined period upon closure of said switch means, whereupon said solenoid is deenergized, thereby opening said gas valve for said second predetermined period upon closure of said switch means.

Claim 13

Dependent Claim 57 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 4, further comprising a console having said torch means, said circuit board support means, and said control means connected thereto, and in which said torch means includes a tank of hydrogen gas connected to said discharge orifice and disposed within said console.

Claim 14

Dependent Claim 46 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 4, further comprising a binocular microscope and means mounting said microscope in position for use in aligning said torch means with said localized area of the underside of said circuit board.

Claim 15

Dependent Claim 90 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 4, comprising a console having said torch means, said circuit board support means, and said control means connected thereto, said console having an upper work surface and having said torch means mounted to said work surface, and in which said means for supporting said circuit board includes a rectangular frame slidably disposed on said work surface and having means for holding said circuit board for positioning said circuit board with respect to said torch means.

Claim 16

Dependent Claim 42 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 11, in which said means for holding said circuit board includes a wire grid connected at its edges to said frame for receiving said circuit board thereon.

Claim 17

Dependent Claim 32 words

Apparatus for soldering an electronic component to a circuit board as set forth in claim 12, further comprising spring means for releasably holding said circuit board in place on said wire grid.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1977-03-18	1977-09-17	1978-03-19	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1981-03-18	1981-09-17	1982-03-19	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	1985-03-18	1985-09-17	1986-03-19	$7700.00	Window Closed / Lapsed

Soldering method and apparatus for ceramic circuits

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