Coaxial sputtering apparatus

Abstract

Abstract This invention provides sequential sputter-coating of materials from different targets onto a desired number of substrates during a single pump-down cycle of the sputtering apparatus. The substrates are detachablyaffixed to the inside surface of a hollow cylinder. The cylinder is mounted upon a rotatable table so that the axis of the cylinder is parallel to the axis of rotation of the table. A plurality of target electrodes extending downward toward the rotatable table are mounted above the table at locations concentric around the axis of rotation of the table and spaced from the axis of rotation by a distance equal to the distance from the axis of rotation of the table to the axis of the cylinder. Vertical slits are provided in the hollow cylinder from the top edges of the cylinder downward toward the rotatable table. The dimensions of the slits are such that as the table is rotated the substrate containing cylinder does not come into contact with any of the target electrodes, yet at selected positions in the course of the table''s rotation the cylinder envelopes in sequence within its volume each one of the target electrodes. Sputtering occurs only when a target electrode is enveloped by the substrate-containing cylinder, and this sputtering takes place in the region within the cylinder. After coating from a particular target has been completed, the table is rotated to bring the cylinder to a new position where it will envelope a different target. Sputtering is then allowed to occur at this new position to produce a lamina of this different coating material. The process may be repeated for a number of target electrodes. It is also possible to provide a plurality of substrate-containing cylinders mounted concentrically on the table about its axis of rotation. Because sputtering takes place within the substrate-containing cylinder and occurs only when a sputter target is enveloped by the cylinder, the likelihood of contamination of the coating laminae material sputtered from other parts of the sputtering apparatus is minimized.

Inventors

• 👤 L Lamont
• 👤 R Dort

Bibliographic Details