US3795845A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip having connecting pads arranged in a non-orthogonal array
Assignee: International Business Machines Corp
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Filing: 1972-12-26
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Granted: 1974-03-05
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Expires: 1992-12-26
Abstract
Abstract A semiconductor chip has its pads, which connect circuits on the chip to electrically conductive elements on a support substrate and form the structural connection between the chip and the substrate, arranged in a plurality of concentric circles with the pads in each circle being equally angularly spaced from each other.
Inventors
- 👤 E Cass
- 👤 R Gustafson
- 👤 P Young
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:01
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W72/00; H10W72/20; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/251; H10W72/252
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
128 words
A semiconductor chip having: a plurality of integrated circuits; a plurality of metallic pads extending beyond a surface thereof, each of said pads being adapted to be electrically connected to at least one of the circuits of said chip; each of said pads being adapted to be fixedly secured to electrically conductive means on a substrate to fixedly secure said chip to the substrate to form an electrical connection between the electrically conductive means on the substratE and any circuit on said chip connected to said pad; and said pads being arranged on said chip in a non-orthogonal array to cause at least a plurality of said pads to be subjected to substantially the same shear stress when fixedly secured to the electrically conductive means on the substrate.
Claim 2
Dependent Claim
128 words
A semiconductor chip having: a plurality of integrated circuits; a plurality of metallic pads extending beyond a surface thereof, each of said pads being adapted to be electrically connected to at least one of the circuits of said chip; each of said pads being adapted to be fixedly secured to electrically conductive means on a substrate to fixedly secure said chip to the substrate to form an electrical connection between the electrically conductive means on the substratE and any circuit on said chip connected to said pad; and said pads being arranged on said chip in a non-orthogonal array to cause at least a plurality of said pads to be subjected to substantially the same shear stress when fixedly secured to the electrically conductive means on the substrate.
Claim 3
Dependent Claim
66 words
The chip according to claim 1 in which said pads are arranged in a plurality of concentric circles to form the non-orthogonal array with the center of said chip forming the center of the circles, each of said pads in each of said circles being subjected to substantially the same shear stress when said pads are fixedly secured to the electrically conductive means on the pads.
Claim 4
Dependent Claim
23 words
The chip according to claim 2 in which said pads of each of the concentric circles are equally angularly spaced from each other.
Claim 5
Dependent Claim
64 words
The chip according to claim 1 in which said pads are arranged in four concentric circles to form the non-orthogonal array with the center of said chip being the center of the circles, each of said pads in each of said circles being subjected to substantially the same shear stress when said pads are fixedly secured to the electrically conductive means on the pads.
Claim 6
Dependent Claim
148 words
The chip according to claim 4 in which: said pads of each of the two innermost circles are equally angularly spaced from each other; each of said pads of one of the two innermost circles is disposed on a radius from the center of the chip that is an equal angular distance from the radii extending from the center of the chip on which the two adjacent pads of the other of the two innermost circles are disposed; said pads of each of two outermost circles are equally angularly spaced from each other; and each of said pads of one of the two outermost circles is disposed on a radius from the center of the chip that is an equal angular distance from the radii extending from the center of the chip on which the two adjacent pads of the other of the two outermost circles are disposed.
Claim 7
Dependent Claim
34 words
The chip according to claim 1 in which said pads are arranged on at least one circle to form the non-orthogonal array with the center of said chip forming the center of the circle.
Claim 8
Dependent Claim
20 words
The chip according to claim 6 in which said pads of any circle are equally angularly spaced from each other.
Claim 9
Dependent Claim
17 words
The chip according to claim 1 in which said pads are equally angularly spaced from each other.
References Cited (Backward Citations)
US3466467A
Cited
US3476992A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-03-04 | 1977-09-03 | 1978-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-03-04 | 1981-09-03 | 1982-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-03-04 | 1985-09-03 | 1986-03-05 | $7700.00 | Window Closed / Lapsed |