Manufacture and testing of thin film circuitry
Abstract
Abstract THE PROCEDURE OF TESTING THE CROSSOVER POINTS FOR SHORT CIRCUITS, IN THIN FILM CIRCUITRY CONTAINING LARGE NUMBERS OF AIR ISOLATED CROSSOVERS, IS SIMPLIFIED BY PROVIDING TEMPORARY THIN FILM INTERCONNECTIONS TO COMBINE DISCRETE CONDUCTIVE PATHS INTO A SMALLER NUMBER OF PATHS NONE OF WHICH CONTAINS A CROSSOVER BRIDGE AND A CROSSUNDER CONDUCTOR FROM THE SAME CROSSOVER POINT, SO THAT MANY CROSSOVERS CAN BE TESTED SIMULTANEOUSLY. THE INTERCONNECTION MAY BE ACCOMPLISHED BY PROVIDING THAT PORTIONS OF A TITANIUM LAYER, USED AS A MEANS FOR BONDING THE CIRCUITRY TO THE SUBSTRATE, ARE ALSO ESTABLISHED AT THE AREAS REQUIRED FOR THE INTERCONNECTION. THE TEMPORARY INTERCONNECTION IS REMOVED, AS BY ETCHING, AFTER THE TESTING IS PERFORMED.
Inventors
- 👤 B Unger
Bibliographic Details
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