Thermo-electric modular structure and method of making same

Claim 1

A METHOD OF MAKING A THERMOELECTRIC MOUBLE WITH THE AID OF AN INSULATING WAFER HAVING OPPOSITE METALLIZED SURFACES, A PAIR OF SIMILAR EQUALIZING SHEETS OF METAL, A HOT-JUNCTION STRAP OF METAL, A THERMOELECTRIC ELEMENT HAVING HOT-AND COLDJUNCTION SURFACES, AND A RADIAROR SHEET OF METAL, SAID METHOD COMPRISING THE STEPS OF A. BRAZING SAID EQUALIZER SHEETS TO SAID OPPOSITE METALLIZED SURFACES, RESPECTIVELY, OF SAID INSULATING WAFER WITH PURE COPPER IN NON-OXIDIZING AMBIENT, B. BRAZING ONE SURFACE OF SAID HOT-JUNCTION STRAP TO ONE OF THE SURFACE OF SAID EQUALIZING SHEET WITH A NICKEL-GOLD ALLOY IN A NON-OXIDIZING AMBIENT, AND C. DIFFUSION BONDING SAID HOT-JUNCTION SURFACE ON SAID THERMOELECTRIC ELEMENT TO THE OTHER SURFACE OF SAID HOT-JUNCTTION STRAP AND SAID RADIATOR SHEET TO SAID COLD-JUNCTION SURFACE OF SAID THERMOLECTRIC ELEMENT, SAID DIFFUSION BONDING BEING CARRIED OUT IN A NON-OXIDIZING AMBIENT, UNDER COMPRESSIVE LOADING, AT A TEMPERATURE OF ABOUT 550*C., AND FOR ABOUT ONE-HALF HOUR.

Claim 2

A METHOD OF MAKING A THERMOELECTRIC MOUBLE WITH THE AID OF AN INSULATING WAFER HAVING OPPOSITE METALLIZED SURFACES, A PAIR OF SIMILAR EQUALIZING SHEETS OF METAL, A HOT-JUNCTION STRAP OF METAL, A THERMOELECTRIC ELEMENT HAVING HOT-AND COLDJUNCTION SURFACES, AND A RADIAROR SHEET OF METAL, SAID METHOD COMPRISING THE STEPS OF A. BRAZING SAID EQUALIZER SHEETS TO SAID OPPOSITE METALLIZED SURFACES, RESPECTIVELY, OF SAID INSULATING WAFER WITH PURE COPPER IN NON-OXIDIZING AMBIENT, B. BRAZING ONE SURFACE OF SAID HOT-JUNCTION STRAP TO ONE OF THE SURFACE OF SAID EQUALIZING SHEET WITH A NICKEL-GOLD ALLOY IN A NON-OXIDIZING AMBIENT, AND C. DIFFUSION BONDING SAID HOT-JUNCTION SURFACE ON SAID THERMOELECTRIC ELEMENT TO THE OTHER SURFACE OF SAID HOT-JUNCTTION STRAP AND SAID RADIATOR SHEET TO SAID COLD-JUNCTION SURFACE OF SAID THERMOLECTRIC ELEMENT, SAID DIFFUSION BONDING BEING CARRIED OUT IN A NON-OXIDIZING AMBIENT, UNDER COMPRESSIVE LOADING, AT A TEMPERATURE OF ABOUT 550*C., AND FOR ABOUT ONE-HALF HOUR.

Claim 3

A method of makIng a thermoelectric modular structure with the aid of an insulating wafer having metallized opposite surfaces, a pair of equalizing sheets of metal, a pair of braze sheets of a relatively high melting point metal, a braze sheet of a relatively lower melting point metal, a hot-junction connecting strap of metal, a thermoelectric element, and a cold-junction connecting strap of metal, said method comprising the steps of a. stacking into a stack, in the order named, one of said equalizer sheets, one of said pair of braze sheets, said wafer, the other of said pair of braze sheets, and the other of said equalizer sheets, b. heating said stack until said pair of braze sheets melt and braze said equalizer sheets to said metallized surfaces of said wafer, respectively, c. stacking said braze sheet of a relatively lower melting point metal on said other equalizer sheet, d. stacking said hot-junction connecting strap on said last-mentioned braze sheet, e. heating said stacked sheets and strap to melt only said braze sheet of said lower melting point metal, whereby to braze said hot-junction connecting strap to said other equalizing sheet, and f. diffusion bonding one surface of said thermoelectric element to said hot-junction connecting strap and another surface of said thermoelectric element to said cold-junction connecting strap.

Claim 4

A method of makIng a thermoelectric modular structure with the aid of an insulating wafer having metallized opposite surfaces, a pair of equalizing sheets of metal, a pair of braze sheets of a relatively high melting point metal, a braze sheet of a relatively lower melting point metal, a hot-junction connecting strap of metal, a thermoelectric element, and a cold-junction connecting strap of metal, said method comprising the steps of a. stacking into a stack, in the order named, one of said equalizer sheets, one of said pair of braze sheets, said wafer, the other of said pair of braze sheets, and the other of said equalizer sheets, b. heating said stack until said pair of braze sheets melt and braze said equalizer sheets to said metallized surfaces of said wafer, respectively, c. stacking said braze sheet of a relatively lower melting point metal on said other equalizer sheet, d. stacking said hot-junction connecting strap on said last-mentioned braze sheet, e. heating said stacked sheets and strap to melt only said braze sheet of said lower melting point metal, whereby to braze said hot-junction connecting strap to said other equalizing sheet, and f. diffusion bonding one surface of said thermoelectric element to said hot-junction connecting strap and another surface of said thermoelectric element to said cold-junction connecting strap.

Claim 5

A method of making a thermoelectric modular structure with the aid of an insulating wafer having metallized opposite surfaces, a pair of equalizing sheets of metal, a pair of braze sheets of pure copper, a braze sheet of a nickel-gold alloy, a hot-junction connecting strap of metal, a thermoelectric element having hot and cold junction shoes, and a cold-junction connecting strap of metal, said method comprising the steps of a. stacking into a stack, in the order named, one of said equalizer sheets, one of said pair of braze sheets, said wafer, the other of said pair of braze sheets, and the other of said equalizer sheets, b. heating said stack to about 1,100*C. to melt said copper braze sheets and to braze said equalizer sheets to said metallized surfaces of said wafer, respectively, c. stacking said braze sheet of nickel-gold alloy and said hot-junction connecting strap on said other equalizer sheet, in the order named, d. heating said stack to melt only said braze sheet of nickel-gold alloy, whereby to braze said hot-junction connecting strap to said other equalizer sheet, e. stacking said thermoelectric element with its hot junction shoe on said hot-junction connecting strap and its cold junction shoe on said cold-junction connecting strap, f. applying compressive pressure to said stack, and g. heating said pressurized stack in a non-oxidizing ambient at about 550*C. for about one-half hour.

Claim 6

A method of making a thermoelectric modular structure with the aid of an insulating wafer having metallized opposite surfaces, a pair of equalizing sheets of metal, a pair of braze sheets of pure copper, a braze sheet of a nickel-gold alloy, a hot-junction connecting strap of metal, a thermoelectric element having hot and cold junction shoes, and a cold-junction connecting strap of metal, said method comprising the steps of a. stacking into a stack, in the order named, one of said equalizer sheets, one of said pair of braze sheets, said wafer, the other of said pair of braze sheets, and the other of said equalizer sheets, b. heating said stack to about 1,100*C. to melt said copper braze sheets and to braze said equalizer sheets to said metallized surfaces of said wafer, respectively, c. stacking said braze sheet of nickel-gold alloy and said hot-junction connecting strap on said other equalizer sheet, in the order named, d. heating said stack to melt only said braze sheet of nickel-gold alloy, whereby to braze said hot-junction connecting strap to said other equalizer sheet, e. stacking said thermoelectric element with its hot junction shoe on said hot-junction connecting strap and its cold junction shoe on said cold-junction connecting strap, f. applying compressive pressure to said stack, and g. heating said pressurized stack in a non-oxidizing ambient at about 550*C. for about one-half hour.

Claim 7

A method of making a thermoelectric modular structure comprising a metal to be heated, an insulating wafer having metallized, opposite surfaces, a pair of equalizing sheets of metal, three braze sheets of a relatively high melting point metal, a braze sheet of a relatively lower melting point metal, a hot-junction connecting strap of metal, a thermoelectric element having hot- and cold-junction shoes, two sheets of gold foil, and a cold-junction connecting strap of metal, said method comprising the steps of a. stacking into a stack on said metal to be heated, in the order named: one of said three braze sheets, one of said equalizer sheets, a second of said three braze sheets, said wafer, a third of said three braze sheets, and the other of said equalizer sheets, b. heating said stack until said three braze sheets melt and braze said equalizer sheets to said metallized surfaces of said wafer, respectively, c. stacking as a continuation of said stack, said braze sheet of a relatively lower melting point metal on said other equalizer sheet, and said hot-junction connecting strap on said last-mentioned braze sheet, d. heating said stack to melt only said braze sheet of said lower melting point metal, whereby to braze said hot-junction connecting strap to said other equalizer sheet, e. stacking on said hot-junction connecting strap, as a further continuation of said stack, in the order named, one of said sheets of gold foil, said thermoelectric element with said hot-junction shoe in contact with said one sheet of gold foil, the other of said sheets of gold foil in contact with said cold-junction shoe, and said cold-junction connecting strap in contact with said other sheet of gold foil, and f. heating said stack at about 550*C. in a non-oxidizing ambient while under compressive loading for about one-half hour.

Claim 8

A method of making a thermoelectric modular structure comprising a metal to be heated, an insulating wafer having metallized, opposite surfaces, a pair of equalizing sheets of metal, three braze sheets of a relatively high melting point metal, a braze sheet of a relatively lower melting point metal, a hot-junction connecting strap of metal, a thermoelectric element having hot- and cold-junction shoes, two sheets of gold foil, and a cold-junction connecting strap of metal, said method comprising the steps of a. stacking into a stack on said metal to be heated, in the order named: one of said three braze sheets, one of said equalizer sheets, a second of said three braze sheets, said wafer, a third of said three braze sheets, and the other of said equalizer sheets, b. heating said stack until said three braze sheets melt and braze said equalizer sheets to said metallized surfaces of said wafer, respectively, c. stacking as a continuation of said stack, said braze sheet of a relatively lower melting point metal on said other equalizer sheet, and said hot-junction connecting strap on said last-mentioned braze sheet, d. heating said stack to melt only said braze sheet of said lower melting point metal, whereby to braze said hot-junction connecting strap to said other equalizer sheet, e. stacking on said hot-junction connecting strap, as a further continuation of said stack, in the order named, one of said sheets of gold foil, said thermoelectric element with said hot-junction shoe in contact with said one sheet of gold foil, the other of said sheets of gold foil in contact with said cold-junction shoe, and said cold-junction connecting strap in contact with said other sheet of gold foil, and f. heating said stack at about 550*C. in a non-oxidizing ambient while under compressive loading for about one-half hour.