Patent US3107096A successfully refreshed from Google Patents.
US3786973A
Expired / Lapsed
US
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Method and apparatus for breaking semiconductor wafers
Assignee: NCR Voyix Corp
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Filing: 1972-03-28
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Granted: 1974-01-22
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Expires: 1992-03-28
Abstract
Abstract The semiconductor wafers, containing a plurality of electrical circuits, are scribed along critical lines so as to provide weakened portions for ease of breaking the wafers along such lines. The wafer is placed between two cylindrical surfaces of prescribed radii, one larger than the other, and a predetermined load is impressed to deform the wafer and to accurately control the stresses throughout the wafer for breaking the wafer into dice containing individual circuits.
Inventors
- 👤 D Bussman
- 👤 F Bell
- 👤 D Filsinger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 10:21
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0005; B28D5/0017; B28D5/0029; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12; Y10T225/30; Y10T225/307; Y10T225/321; Y10T225/325
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
99 words
Apparatus for breaking semiconductor wafers having scribed lines thereon comprising a first member having a cylindrical radius of curvature, a second cylindrical member having a radius of curvature proportional to the radius of said first member and rollable along the curvature of the first member, and means including an arm and spring means connected to the arm and to the second member for exerting a predetermined force on the second member as it rolls across a semiconductor wafer placed between said first and said second curved members for breaking the wafer in sequential order along the scribe lines thereon.
Claim 2
Dependent Claim
99 words
Apparatus for breaking semiconductor wafers having scribed lines thereon comprising a first member having a cylindrical radius of curvature, a second cylindrical member having a radius of curvature proportional to the radius of said first member and rollable along the curvature of the first member, and means including an arm and spring means connected to the arm and to the second member for exerting a predetermined force on the second member as it rolls across a semiconductor wafer placed between said first and said second curved members for breaking the wafer in sequential order along the scribe lines thereon.
Claim 3
Independent Claim
66 words
A method of breaking a semiconductor wafer comprising the steps of scribing intersecting lines on one surface of the wafer, placing the wafer between two curved surface members wherein the radius of curvature of one is less than the radius of curvature of the other, and rolling the curved surface member of lesser radius across the wafer to deform and break the wafer along said lines.
Claim 4
Independent Claim
66 words
A method of breaking a semiconductor wafer comprising the steps of scribing intersecting lines on one surface of the wafer, placing the wafer between two curved surface members wherein the radius of curvature of one is less than the radius of curvature of the other, and rolling the curved surface member of lesser radius across the wafer to deform and break the wafer along said lines.
Claim 5
Dependent Claim
24 words
The method of claim 2 wherein the wafer is encased and the scribe lines are adjacent the member having the larger radius of curvature.
Claim 6
Dependent Claim
26 words
The method of claim 2 wherein the curved surface member of lesser radius includes sufficient mass to break the wafer along said lines in progressive manner.
Claim 7
Dependent Claim
30 words
The method of claim 2 including the step of providing an external force to the curved member of lesser radius for breaking the wafer along said lines in progressive manner.
Claim 8
Independent Claim
61 words
A method of breaking a semiconductor wafer having scribed lines on one surface thereof and contained in an enclosure, comprising the steps of placing the wafer on a concave-surfaced member, and rolling a cylindrical-surfaced member having a radius of curvature less than the radius of curvature of the concave-surfaced member across the wafer to break the wafer along the scribed lines.
Claim 9
Independent Claim
61 words
A method of breaking a semiconductor wafer having scribed lines on one surface thereof and contained in an enclosure, comprising the steps of placing the wafer on a concave-surfaced member, and rolling a cylindrical-surfaced member having a radius of curvature less than the radius of curvature of the concave-surfaced member across the wafer to break the wafer along the scribed lines.
Claim 10
Dependent Claim
22 words
The method of claim 10 wherein the cylindrical-surfaced member includes sufficient mass to break the wafer along said lines in progressive manner.
Claim 11
Dependent Claim
27 words
The method of claim 10 including the step of providing an external force to the cylindrical-surfaced member for breaking the wafer along said lines in progressive manner.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-01-21 | 1977-07-23 | 1978-01-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-01-21 | 1981-07-23 | 1982-01-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-01-21 | 1985-07-23 | 1986-01-22 | $7700.00 | Window Closed / Lapsed |