US3784726A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microcircuit package assembly
Assignee: HP Inc
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Filing: 1971-05-20
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Granted: 1974-01-08
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Expires: 1991-05-20
Abstract
Abstract A hermetically sealed package for microcircuits employs a base plate on which one or more microcircuits may be mounted by, for example, soldering thereto or by means of studs, the studs being positioned in the base plate so as to accommodate the microcircuits which are held down on the base plate, for example, by spring fasteners mounted on the studs. The microcircuits may be mounted on a heat conductive carrier base. Electrical feedthroughs are hermetically sealed in the base plate. In certain forms of the package, an isolation wall structure is employed to isolate one microcircuit from another, the wall being secured to the base plate via studs and stud fasteners. A cover is hermetically sealed to the base plate over the microcircuits, carrier, isolation wall and feedthroughs. A novel diffusion weld technique is used to seal the studs and feedthroughs in the base plate.
Inventors
- 👤 J Smith
- 👤 G Drennan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:18
CPC Classifications
H; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
79 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a base of ductile material for supporting the microcircuit structure, nd at least one cylindrical electrical feedthrough having an outer surface of a ductile material and being positioned in a cylindrical hole in said base, said base being deformed around said feedthrough providing a cold diffusion weld between said feedthrough and said base for permitting hermetically sealed electrical connection to the microcircuit structure.
Claim 2
Dependent Claim
79 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a base of ductile material for supporting the microcircuit structure, nd at least one cylindrical electrical feedthrough having an outer surface of a ductile material and being positioned in a cylindrical hole in said base, said base being deformed around said feedthrough providing a cold diffusion weld between said feedthrough and said base for permitting hermetically sealed electrical connection to the microcircuit structure.
Claim 3
Dependent Claim
84 words
A modular package as in claim 1 wherein said package includes a microcircuit structure, said base includes a first portion supporting said microcircuit structure and a second portion extending normal to said first portion, said electrical feedthrough is diffusion welded in a cylindrical hole in said second portion, and said package includes a cover of ductile material cold diffusion welded to said second portion around said first portion, said microcircuit structure, and said electrical feedthrough providing a hermetically sealed envelope for said microcricuit structure.
Claim 4
Dependent Claim
67 words
A modular package as in claim 1 wherein said package includes a microcircuit structure, said base includes a block Having a cavity within which said microcircuit structure is supported, said electrical feedthrough is cold diffusion welded in a cylindrical hole in said block and in communication with said cavity, and said package including a cover of ductile material cold diffusion welded to said block over said cavity.
Claim 5
Dependent Claim
40 words
A modular package as in claim 1 including a microcircuit structure mounted on said base, and a cover hermetically sealed to said base around said microcircuit structure and said electrical feedthrough providing a hermetically sealed envelope for said microcircuit structure.
Claim 6
Dependent Claim
90 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a base of ductile material, a plurality of studs secured to said base and extending inwardly into the package from one surface thereof, mounting means on said studs for engaging the microcircuit structure to urge the microcircuit structure down onto said one surface of said base and to hold the microcircuit structure in place thereon, at least one electrical feedthrough cold diffusion welded through said base for permitting electrical connection to the microcircuit structure.
Claim 7
Dependent Claim
90 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a base of ductile material, a plurality of studs secured to said base and extending inwardly into the package from one surface thereof, mounting means on said studs for engaging the microcircuit structure to urge the microcircuit structure down onto said one surface of said base and to hold the microcircuit structure in place thereon, at least one electrical feedthrough cold diffusion welded through said base for permitting electrical connection to the microcircuit structure.
Claim 8
Dependent Claim
29 words
A modular package as in claim 5 wherein said package includes a microcircuit structure, and said studs and said electrical feedthrough are all cold diffusion welded to said base.
Claim 9
Dependent Claim
117 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a microcircuit structure, a base of ductile material including a first portion supporting the microcircuit structure and a second portion extending normal to said first portion, at least one electrical feedthrough hermetically sealed in said second portion, a plurality of studs secured to said base and extending inwardly into said package, mounting means engaging said studs and said microcircuit structure to urge said microcircuit structure down onto said first portion of said base and to hold said microcircuit structure in place thereon, and a cover secured to said second portion around said first portion, said microcircuit structure, and said electrical feedthrough.
Claim 10
Dependent Claim
117 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a microcircuit structure, a base of ductile material including a first portion supporting the microcircuit structure and a second portion extending normal to said first portion, at least one electrical feedthrough hermetically sealed in said second portion, a plurality of studs secured to said base and extending inwardly into said package, mounting means engaging said studs and said microcircuit structure to urge said microcircuit structure down onto said first portion of said base and to hold said microcircuit structure in place thereon, and a cover secured to said second portion around said first portion, said microcircuit structure, and said electrical feedthrough.
Claim 11
Dependent Claim
102 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a base of ductile material, a plurality of studs hermetically sealed to said base by a cold diffusion weld between said stud and said base and extending inwardly into said package from one surface thereof, mounting means for engaging said studs and the microcircuit structure to urge the microcircuit structure down onto said one surface of said base and to hold the microcitcuit structure in place thereon, at least one electrical feedthrough cold diffusion welded through said base for permitting electrical connection to the microcircuit structure.
Claim 12
Dependent Claim
102 words
A modular package for mounting a microcircuit structure in a hermetically sealed environment, said package comprising a base of ductile material, a plurality of studs hermetically sealed to said base by a cold diffusion weld between said stud and said base and extending inwardly into said package from one surface thereof, mounting means for engaging said studs and the microcircuit structure to urge the microcircuit structure down onto said one surface of said base and to hold the microcitcuit structure in place thereon, at least one electrical feedthrough cold diffusion welded through said base for permitting electrical connection to the microcircuit structure.
Claim 13
Dependent Claim
39 words
A modular package as in claim 8 wherein said mounting means comprises spring members mounted on said studs for urging the microcircuit structure down onto said one surface of said base and holding the microcircuit structure in place thereon.
Claim 14
Dependent Claim
18 words
A modular package as in claim 9 wherein said spring members comprise spring clips mounted on said studs.
Claim 15
Dependent Claim
80 words
A modular package comprising a carrier and a microcircuit fixedly mounted on said carrier, a base of ductile material, a plurality of studs secured to one surface of said base and extending inwardly into said package, mounting means engaging said studs and said carrier to urge said carrier down onto said one surface of said base and hold said carrier in place thereon, and at least one electrical feedthrough hermetically sealed through said base and electrically connected to said microcircuit.
Claim 16
Dependent Claim
80 words
A modular package comprising a carrier and a microcircuit fixedly mounted on said carrier, a base of ductile material, a plurality of studs secured to one surface of said base and extending inwardly into said package, mounting means engaging said studs and said carrier to urge said carrier down onto said one surface of said base and hold said carrier in place thereon, and at least one electrical feedthrough hermetically sealed through said base and electrically connected to said microcircuit.
Claim 17
Dependent Claim
39 words
A modular package as in claim 11 wherein said base is flat, and said package includes a cover secured to said base around said carrier, said microcircuit, and said electrical feedthrough providing a hermetically sealed environment for said microcircuit.
Claim 18
Dependent Claim
59 words
A modular package as in claim 11 wherein said base includes A first portion supporting said carrier and a second portion extending normal to said first portion, said electrical feedthrough is mounted in said second portion, and said package includes a cover secured to said second portion around said first portion, said carrier, said microcircuit, and said electrical feedthrough.
Claim 19
Dependent Claim
26 words
A modular package as in claim 11 wherein said studs are hermetically sealed in said base by a diffusion weld between said studs and said base.
Claim 20
Dependent Claim
37 words
A modular package as in claim 14 wherein said mounting means comprises spring members mounted on said studs and urging the carrier down onto said one surface of said base and holding the carrier in place thereon.
References Cited (Backward Citations)
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Cited
US3020454A
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US3119052A
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US3549949A
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US3548076A
Cited
US3519896A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-01-07 | 1977-07-09 | 1978-01-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-01-07 | 1981-07-09 | 1982-01-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-01-07 | 1985-07-09 | 1986-01-08 | $7700.00 | Window Closed / Lapsed |