High k dielectric printing pastes

Abstract

Abstract UNIQUE DIELECTRIC COMPOSITIONS MAY BE USED TO FORMULATE THICK FILM PASTES FOR PRINTING MICROELECTRONIC CAPACITORS. THE RESLUTING DIELECTRICS EXHIBIT DIELECTRIC CONSTANTS GREATER THAN ABOUT 500 AND CAPACITANCES GREATER THAN ABOUT 80,000 PICONFARADS PER SQUARE INCH AT A THICKNESS OF AT LEAST ABOUT 1.0 MIL. THE UNIQUE DIELECTRIC COMPOSITIONS COMPRISE ABOUT 55-76 PERCENT BY WEIGHT OF A FERROLECTRIC MATERIAL AND 45-24 PERCENT OF A GLASS BINDER. THE GLASS BINDER EMPLOYED COMPRISES A LEAD BARIUM BOROSILICATE GLASS AND A FERROELECTRIC MATERIAL PREVIOUSLY DISSOLVED THEREIN. THE COMPOSITION IS FORMULTED INTO A PRINTING PASTE BY FIRST DISSOLVING 20-30 PERCENT BY WEIGHT FERROELECTRIC INTO 70-80 PERCENT BY WEIGHT LEAD BARIUM BOROSILICATE GLASS BINDER, COOLING THE NEWLY FORMED GLASS TO A SOLID STATE, COMMINUTING THE GLASS TO A PARTICLE SIZE OF LESS THAN ABOUT 1 MICRON AND THEREAFTER ADMIXING THE COMMINUTED GLASS WITH THE SAME PARTICULTE FERROELECTRIC IN AN AMOUNT AS INDICATED. THIS ADMIXTURE IS THEN ADDED TO A LIQUID ORGANIC CARRIER VEHICLE TO FORMULATE THE PRINTING PASTE. THE RPINTING PASTE IS THEN PRINTED INTO A CHOSEN DESING AND FIRED AT A TEMPERATURE OF APPROXIMATELY 1,000-1,050*C. TO PRODUCE A HIGHLY DENSE, UNIFORM, AND SUBSTANTIALLY CRACK-FREE DIELECTRIC MATERIAL.

Inventors

• 👤 D Mason

Bibliographic Details