US3775838A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package and construction technique
Assignee: Olivetti SpA
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Filing: 1972-04-24
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Granted: 1973-12-04
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Expires: 1992-04-24
Abstract
Abstract Disclosed is an integrated circuit arrangement and construction technique wherein an improved circuit board, having deposited thereon resistors and conductors, is constructed by means of a combination of evaporation and electrodeposition techniques. A layer of resistive material and a layer of conductive material are successively deposited by means of evaporation onto a substrate. A third layer of conductive material is then deposited by means of electroplating. The construction process includes a high temperature stabilization phase, an improved resistor trim by means of electroerosion, and a semiconductor afixation phase which utilizes high temperature gas in conjunction with mechanical friction.
Inventors
- 👤 C Dalmasso
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:20
CPC Classifications
H; H10; H10W; H10W99/00; H10D; H10D86/00; H10D86/80; H10D86/85; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
24 words
The process according to claim 1 wherein said conductive layers are of gold, said resistive layer is NiCr, and said insulative layer is ceramic.
Claim 2
Dependent Claim
18 words
The process according to claim 1 wherein said second conductive layer is 2.5 to 5 microns in thickness.
Claim 3
Dependent Claim
52 words
The process according to claim 1 comprising following said step of removing said first conductive layer and said resistive layer only from said second region, the additional step of: heating said circuit network in an inert atmosphere prior to said step of affixing said semiconductor circuit elements to said second conductive layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-03 | 1977-06-04 | 1977-12-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-03 | 1981-06-04 | 1981-12-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-03 | 1985-06-04 | 1985-12-04 | $7700.00 | Window Closed / Lapsed |