US3774232A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for integrated circuit chip
Assignee: Circuit Stik Inc
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Filing: 1971-11-11
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Granted: 1973-11-20
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Expires: 1991-11-11
Abstract
Abstract An improved microcircuit package is provided for integrated circuit chips, or the like, and which greatly simplifies the manner in which electrical connections may be made between the contacts on the chip and the terminal electrodes and other connections of the microcircuit. The package of the invention comprises a substrate of glass ceramic, polymide, or the like, having adhesive electric conductors formed on its surface, which conductors make connection between the contacts on the integrated circuit chip and the terminal electrodes, merely by pressing the chip over the adhesive electric conductors, the conductors serving additionally to hold and position the chip in the flat pack.
Inventors
- 👤 D May
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 19:47
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
110 words
A microcircuit package comprising a flat dielectric substrate, an integrated circuit chip mounted on said substrate; a plurality of elongated electrical terminal leads mounted on said substrate along at least one edge thereof and extending outwardly from said edge; and a plurality of resinous adhesive electrical conductors formed on said substrate under said chip and under respective ones of said terminal leads and in bonded electrical contact with corresponding electrical contacts of said chip and extending across said substrate into bonded electrical contact with said respective ones of said terminal leads, said resinous adhesive electrical conductors amd being the sub-attachment of said chip and said terminal leads to said substrate.
Claim 2
Dependent Claim
110 words
A microcircuit package comprising a flat dielectric substrate, an integrated circuit chip mounted on said substrate; a plurality of elongated electrical terminal leads mounted on said substrate along at least one edge thereof and extending outwardly from said edge; and a plurality of resinous adhesive electrical conductors formed on said substrate under said chip and under respective ones of said terminal leads and in bonded electrical contact with corresponding electrical contacts of said chip and extending across said substrate into bonded electrical contact with said respective ones of said terminal leads, said resinous adhesive electrical conductors amd being the sub-attachment of said chip and said terminal leads to said substrate.
Claim 3
Dependent Claim
27 words
The package defined in claim 1, in which said resinous adhesive electrical conductors are formed of an adhesive epoxy having particles of electrically conductive material disposed therein.
Claim 4
Dependent Claim
29 words
The package defined in claim 1, and which includes a base plate, and in which said substrate and said chip are received in a well in said base plate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-11-19 | 1977-05-21 | 1977-11-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-11-19 | 1981-05-21 | 1981-11-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-11-19 | 1985-05-21 | 1985-11-20 | $7700.00 | Window Closed / Lapsed |