Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
213 words
A memory element including a silicon substrate of a first conductivity type having first and second spaced-apart regions of a second conductivity type formed in a major surface thereof such that a channel region of the first conductivity type is provided therebetween, at least one region of the substrate situated adjacent to the channel region being isolated from the first and second regions; at least one other region of the second conductivity type formed in the said major surface adjacent to the channel region, the said one other region being isolated from the first and second regions; a dielectric layer formed on the said major surface such that it covers the first and second regions, the said one other region and the isolated substrate region; a silicon gate buried within the dielectric layer such that it is substantiall/ parallel to, and electrically isolated from, the said major surface, the silicon gate partially overlapping each of the first and second regions, the said one other region and the isolated substrate region; a first electrode formed on the surface of the dielectrical layer such that it is above and completely overlaps the silicon gate; and second and third electrodes which are each in electrical contact with a separate one of the first and second regions.
Claim 2
Dependent Claim
213 words
A memory element including a silicon substrate of a first conductivity type having first and second spaced-apart regions of a second conductivity type formed in a major surface thereof such that a channel region of the first conductivity type is provided therebetween, at least one region of the substrate situated adjacent to the channel region being isolated from the first and second regions; at least one other region of the second conductivity type formed in the said major surface adjacent to the channel region, the said one other region being isolated from the first and second regions; a dielectric layer formed on the said major surface such that it covers the first and second regions, the said one other region and the isolated substrate region; a silicon gate buried within the dielectric layer such that it is substantiall/ parallel to, and electrically isolated from, the said major surface, the silicon gate partially overlapping each of the first and second regions, the said one other region and the isolated substrate region; a first electrode formed on the surface of the dielectrical layer such that it is above and completely overlaps the silicon gate; and second and third electrodes which are each in electrical contact with a separate one of the first and second regions.
Claim 3
Dependent Claim
80 words
A memory element as claimed in claim 1 wherein the element includes two regions of the second conductivity type formed in the said major surface on opposite sides of the channel region, the two regions being partially overlapped by the silicon gate and isolated from the first and second regions and wherein two regions of the substrate situated on opposite sides of the channel region are isolated from the first and second regions and partially overlapped by the silicon gate.
Claim 4
Dependent Claim
35 words
A memory element as claimed in claim 1 wherein each of the isolated regions is surrounded in the substrate by an oxide layer to effect isolation of the region from the first and second regions.
Claim 5
Dependent Claim
18 words
A memory element as claimed in claim 3 wherein each of the oxide layers is of silicon dioxide.
Claim 6
Dependent Claim
57 words
A memory element as claimed in claim 1 wherein the thickness of those sections of the dielectric layer which are contiguous with the edges of each of the isolated regions is greater than the thickness of the remainder of the dielectric layer by an amount which effects isolation of the regions from the first and second regions.
Claim 7
Dependent Claim
24 words
A memory element as claimed in claim 1 wherein the first conductivity type is n-type and wherein the second conductivity type is p+ type.
Claim 8
Dependent Claim
213 words
A memory element including a silicon substrate of a first conductivity type having first and second spaced apart regions of a second conductivity type formed in a major surface thereof such that a channel region of the first conductivity type is provided therebetween, two regions of the substrate situated one on each side of the channel region being isolated from the first and second regions; third and fourth regions of the second conductivity type formed in the said major surface and situated one on each side of the channel region, the third and fourth regions being isolated from the first and second regions; a dielectric layer formed on the said major surface such that it covers the first second third and fourth regions and isolated substrate regions; a silicon gate buried within the dielectric layer such that it is substantially parallel to, and electrically isolated from, the said major surface, the silicon gate partially overlapping each of the first second second third and fourth regions and the isolated substrate regions; a first electrode formed on the surface of the dielectric layer such that it is above and completely overlaps the silicon gate; and second and third electrodes which are each in electrical contact with a separate one of the first and second regions.
Claim 9
Dependent Claim
213 words
A memory element including a silicon substrate of a first conductivity type having first and second spaced apart regions of a second conductivity type formed in a major surface thereof such that a channel region of the first conductivity type is provided therebetween, two regions of the substrate situated one on each side of the channel region being isolated from the first and second regions; third and fourth regions of the second conductivity type formed in the said major surface and situated one on each side of the channel region, the third and fourth regions being isolated from the first and second regions; a dielectric layer formed on the said major surface such that it covers the first second third and fourth regions and isolated substrate regions; a silicon gate buried within the dielectric layer such that it is substantially parallel to, and electrically isolated from, the said major surface, the silicon gate partially overlapping each of the first second second third and fourth regions and the isolated substrate regions; a first electrode formed on the surface of the dielectric layer such that it is above and completely overlaps the silicon gate; and second and third electrodes which are each in electrical contact with a separate one of the first and second regions.