Abstract The wave soldering apparatus of present disclosure includes a sump for receipt of a predetermined level of molten solder and having a driveshaft-receiving opening in the bottom wall thereof. A fountain is disposed in such sump and is formed with a chamber that leads upwardly above the predetermined level and terminates in a horizontally disposed outlet orifice. Molten solder is pumped into the lower portion of such fountain by pump means which includes an impeller having a driveshaft projecting therefrom and through the driveshaft-receiving opening. Barrier means surrounds such driveshaft means to block molten solder from coming into contact therewith and leaking out through the driveshaft-receiving opening.
Bottom drive soldering apparatus comprising: a sump for receipt of a predetermined level of molten solder compound and having one wall formed with a drive shaftreceiving opening disposed in the lower portion thereof; a fountAin disposed in said sump and formed in its lower portion with an inlet and including an upwardly opening horizontally extending orifice disposed at the top of said apparatus; pump means disposed in said sump for pumping molten solder compound in said inlet and including impeller means having drive shaft means extending therefrom and through said opening; driven means on the projecting extremity of said drive shaft means; barrier tube means surrounding said drive shaft means and projecting upwardly to said predetermined level for blocking molten solder compound from contacting said drive shaft means and leaking out said drive shaft-receiving opening; and drive means coupled with said driven means for driving said impeller means to pump molten solder compound from said sump in said inlet and upwardly in said fountain and out said orifice to form a standing wave located above said apparatus so work pieces to be soldered may be passed along any horizontal path to engage said wave, and the activity of workmen working therewith will be unobstructed by said drive means.
Claim 2
Dependent Claim
208 words
Bottom drive soldering apparatus comprising: a sump for receipt of a predetermined level of molten solder compound and having one wall formed with a drive shaftreceiving opening disposed in the lower portion thereof; a fountAin disposed in said sump and formed in its lower portion with an inlet and including an upwardly opening horizontally extending orifice disposed at the top of said apparatus; pump means disposed in said sump for pumping molten solder compound in said inlet and including impeller means having drive shaft means extending therefrom and through said opening; driven means on the projecting extremity of said drive shaft means; barrier tube means surrounding said drive shaft means and projecting upwardly to said predetermined level for blocking molten solder compound from contacting said drive shaft means and leaking out said drive shaft-receiving opening; and drive means coupled with said driven means for driving said impeller means to pump molten solder compound from said sump in said inlet and upwardly in said fountain and out said orifice to form a standing wave located above said apparatus so work pieces to be soldered may be passed along any horizontal path to engage said wave, and the activity of workmen working therewith will be unobstructed by said drive means.
Claim 3
Dependent Claim
31 words
Wave soldering apparatus as set forth in claim 1 wherein: said barrier means includes a barrier tube telescoped over said driveshaft means and projecting from said opening to said pump means.
Claim 4
Dependent Claim
88 words
Wave soldering apparatus as set forth in claim 1 wherein: said impeller means is arranged with its axis extending vertically and is formed in its center with a through vertical passage; and said driveshaft means includes hollow drive pipe means projecting upwardly from the center of said impeller and terminating in an upper extremity disposed above said predetermined level and a driveshaft projecting upwardly into said driveshaft pipe means; and coupling means coupling said upper extremity of said drive pipe means to the upper extremity of said driveshaft.
Claim 5
Dependent Claim
95 words
Wave soldering apparatus as set forth in claim 1 wherein: said pump means is disposed exteriorly of said fountain and is arranged with the axis of said impeller means extending vertically, said pump means including a housing formed in its top and bottom sides with respective upper and lower inlets for receiving a selected ratio of solder and oil compound for said pump means whereby oil compound means may be floated on said molten solder and a predetermined ratio of oil compound means will be drawn in said inlets during operation of said pump means.
Claim 6
Dependent Claim
38 words
Wave soldering apparatus as set forth in claim 1 wherein: said impeller means is arranged with its axis extending vertically; said shaft-receiving opening is formed in the bottom wall of said sump for and receiving said shaft means.
Claim 7
Dependent Claim
22 words
Wave soldering apparatus as set forth in claim 1 that includes: bearing means interposed between said driveshaft means and said barrier means.
Claim 8
Dependent Claim
22 words
Wave soldering apparatus as set forth in claim 3 that includes: bearing means interposed between said driveshaft means and said barrier means.