Dry replenishment of electroless copper solutions
Abstract
Abstract This invention is for replenishment of an aqueous electroless copper plating solution and to apparatus useful therefore. The process comprises addition of replenishers in essentially dry form in a manner that avoids triggering of the bath. Typical replenishers that may be added in dry form include one or more of a source of cupric ions such as cupric sulphate, a reducing agent for cupric ions such as paraformaldehyde, a chelating agent for cupric ions, bath stabilizers, brighteners, surfactants and the like. These ingredients may be added singularly or admixed with each other. Essentially dry materials are used for replenishment rather than a solution as in the prior art to prevent volume growth of the plating solution.
Inventors
- 👤 O Dutkewych
- 👤 L Hofman
Bibliographic Details
Claims Analysis
Total Claims: 12References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-11-05 | 1977-05-07 | 1977-11-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-11-05 | 1981-05-07 | 1981-11-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-11-05 | 1985-05-07 | 1985-11-06 | $7700.00 | Window Closed / Lapsed |