Method of preparing ruthenium- or iridium-containing components for resistors
Abstract
Abstract A COMPOSITION FOR USE IN THICK FILM RESISTIVE ELEMENTS HAVING A LOW TEMPERATURE COEFFICIENT OF RESISTANCE IS PREPARED BY CODEPOSITING FROM AN AQUEOUS SOLUTION AT LEAST TWO PRECIOUS METALS ONE OF WHICH IS RUTHENIUM OR IRIDIUM ONTO LEAD-CONTAINING GLASS FRIT, OTHER METAL COMPONENTS MAY ALSO BE DEPOSITED ON THE GLASS FRIT; PREFIRING THE RESULTING GLASS FRIT AT A TEMPERATURE OF AT LEAST ABOUT 600* C., AND PREFERABLY BELOW THE MELTING POINT OF THE PRECIOUS METALS DEPOSITED THEREONF AND COMMINUTING THE PREFIRED GLASS FRIT TO A SIZE SUITABLE TO BE FORMULATED IN A RESISTOR PASTE TO PREPARE THICK FILM RESISTIVES. A PARTICULARLY ADVANTAGEOUS GLASS FRIT FOR APPLICATION IN THICK FILM RESISTIVES HAS DEPOSITED THEREON RUTHENIUM OR IRIDIUM, GOLD OR PLATINUM, AND RHODIUM. PREFERABLY, THE COMPOSITION IS ESSENTIALLY FREE OF SILVER.
Inventors
- 👤 C Kuo
- 👤 H Angel
Bibliographic Details
Claims Analysis
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