US3769108A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacture of beam-crossovers for integrated circuits
Assignee: AT&T Inc
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Filing: 1971-12-03
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Granted: 1973-10-30
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Expires: 1991-12-03
Abstract
Abstract A prefabricated substrate for forming hybrid integrated circuits utilizes nests of prefabricated beam crossovers. Standardized masks are utilized for forming the beam crossover nests at fixed locations on the substrate. The metal spacing and support layer is retained under the beam crossovers while the subsequent pattern generation steps, such as defining the interconnection conductor pattern, are completed and the layer is then removed. Integrated circuit chips and lead frames are then mounted on the substrate to complete the hybrid integrated circuit.
Inventors
- 👤 W Worobey
- 👤 D Feldman
- 👤 N Lesh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 09:51
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10N; H10N97/00; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435; Y10T29/49; Y10T29/4981; Y10T29/49812
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
42 words
The method of claim 1 wherein: said first conductor comprises a composite layer including films of titanium, palladium and gold; said supporting layer comprises a composite layer including films of titanium and copper; and said second conductor comprises a layer of gold.
Claim 2
Independent Claim
154 words
The method of fabricating beam cross-overs for integrated circuits on a substrate comprising the steps of forming a pattern of first conductors on said substrate, depositing a layer of etchable material on top of said first conductors, and forming a pattern of second conductors over said layer, said second conductors including crossover regions with respect to said first conductors, said second conductors having insufficient strength in said crossover regions to withstand subsequent processing steps in said method; characterized in that said method includes: completing said subsequent processing steps while masking said cross over regions to retain said layer of material in said crossover regions to support said second conductors; and removing said supporting layer in said crossover regions by etching after said subsequent processing steps are completed to leave said first and second conductors in spaced relationship in said crossover regions, whereby beam crossovers can be fabricated as the initial step in said method.
References Cited (Backward Citations)
US3575822A
Cited
US3461524A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-29 | 1977-04-30 | 1977-10-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-29 | 1981-04-30 | 1981-10-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-29 | 1985-04-30 | 1985-10-30 | $7700.00 | Window Closed / Lapsed |