Abstract An insulated cable having a cross-linked insulating layer and a cross-linked semiconductive insulation shielding layer, said layers having been formed by extrusion-coating simultaneously a composition for the insulating layer mainly composed of a polyolefin type polymer, such as polyethylene or a polyethylene copolymer and containing di- Alpha -cumyl peroxide as the crosslinking agent and a composition for the semiconductive outer layer mainly composed of a polyolefin type polymer such as polyethylene or a polyethylene copolymer containing carbon black for providing the semiconductivity to said layer and 2,5-dimethyl-2,5-di-(t-butylperoxy)-hexyne-3 as the cross-linking agent and then cross-linking the layers by heating.
The insulated cable of claim 1 wherein said first cross-linked insulating layer and said outer cross-linked semiconductive insulation shielding layer consist essentially of simultaneously extruded and simultaneously cross-linked layers.
Claim 2
Dependent Claim
22 words
The insulated cable of claim 2 further consisting essentially of a semiconductive layer intermediate said conductor and said first cross-linked insulating layer.
Claim 3
Dependent Claim
28 words
The insulated cable of claim 2 wherein at least one of said ethylene-containing copolymers is an ethylene-acrylate copolymer, an ethylene-vinyl acetate copolymer or an ethylene-vinyl acetate-vinyl chloride terpolymer.
Claim 4
Dependent Claim
90 words
A process for producing an insulated cable comprising simultaneously extruding, around a conductor, a first cross-linkable insulating layer surrounding said conductor and an outer cross-linkable semiconductive insulation shielding layer surrounding said first layer, said first layer consisting essentially of non-cross-linked polyethylene or an ethylene-containing copolymer and di- Alpha -cumyl peroxide and said outer layer consisting essentially of non-cross-linked polyethylene or an ethylene-containing copolymer and 2,5-di-methyl-2,5-di-(p-butylperoxy)-hexyne-3 and containing a sufficient amount of carbon black to make said outer layer semiconductive; and subsequently simultaneously cross-linking said first layer and said outer layer.