US3768548A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cooling apparatus for semiconductor devices
Assignee: MOTOR CO
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Filing: 1972-03-02
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Granted: 1973-10-30
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Expires: 1992-03-02
Abstract
Abstract Apparatus is described for cooling one or more semiconductor devices, such as diodes or thyristors or transistors, with a liquid. The apparatus includes first and second heat-sink members positioned in electrical contact with electrodes of the semiconductor device. The heat-sink members have flow passages within them, and a manifold having at least one flow passage within it interconnects the flow passages in the heat-sink members. During the use of the semiconductor device, a liquid coolant is circulated through the flow passages in the manifold and heat-sink members to effect cooling of the device.
Inventors
- 👤 W Dilay
- 👤 E Zulinski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 22:12
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
254 words
Apparatus for cooling a semiconductor device with a liquid, said device having anode and cathode electrodes, which apparatus comprises: a first heat-sink member positioned in electrical contact with one of said electrodes, said first heat-sink member having a flow passage extending therethrough to permit said liquid to flow therethrough; a second heat-sink member positioned in electrical contact with the other of said electrodes, said second heat-sink member having a flow passage therethrough to permit said liquid to flow therethrough; and a manifold for conducting said liquid to and away from said flow passages in said first and second heat-sink members, said first and second heat-sink members being mounted on said manifold, said manifold being made from electrically nonconductive material, said manifold comprising a first piece having at least one open channel formed therein, a second piece bonded to said first piece, said second piece being made from a sheet material and being positioned on said first piece to seal said open channel in said first piece, thereby, to form closed passages through which said liquid can be made to flow, said manifold having an inlet port for receiving said liquid and a first flow passage extending from said inlet port to said first heat-sink member flow passage, said manifold having a second flow passage interconnecting said flow passages in said first and second heat-sink members, and said manifold having a third flow passage extending from said second heat-sink member flow passage to a discharge port for the discharge of said liquid from said manifold.
Claim 2
Dependent Claim
254 words
Apparatus for cooling a semiconductor device with a liquid, said device having anode and cathode electrodes, which apparatus comprises: a first heat-sink member positioned in electrical contact with one of said electrodes, said first heat-sink member having a flow passage extending therethrough to permit said liquid to flow therethrough; a second heat-sink member positioned in electrical contact with the other of said electrodes, said second heat-sink member having a flow passage therethrough to permit said liquid to flow therethrough; and a manifold for conducting said liquid to and away from said flow passages in said first and second heat-sink members, said first and second heat-sink members being mounted on said manifold, said manifold being made from electrically nonconductive material, said manifold comprising a first piece having at least one open channel formed therein, a second piece bonded to said first piece, said second piece being made from a sheet material and being positioned on said first piece to seal said open channel in said first piece, thereby, to form closed passages through which said liquid can be made to flow, said manifold having an inlet port for receiving said liquid and a first flow passage extending from said inlet port to said first heat-sink member flow passage, said manifold having a second flow passage interconnecting said flow passages in said first and second heat-sink members, and said manifold having a third flow passage extending from said second heat-sink member flow passage to a discharge port for the discharge of said liquid from said manifold.
Claim 3
Dependent Claim
29 words
Apparatus in accordance with claim 1, wherein said second flow passage interconnecting said flow passages in said first and second heat-sink members is folded back and forth upon itself.
Claim 4
Dependent Claim
36 words
Apparatus in accordance with claim 1, wherein said first piece of said manifold further includes a plurality of bosses, said bosses containing flow passages, and said first and second heat-sink members being attached to said bosses.
Claim 5
Dependent Claim
29 words
Apparatus in accordance with claim 3, wherein said second flow passage interconnecting said flow passages in said first and second heat-sink members is folded back and forth upon itself.
Claim 6
Dependent Claim
129 words
Apparatus for cooling a semiconductor device with a liquid, said device having anode and cathode electrodes, which apparatus comprises: a first heat-sink member positioned in electrical contact with one of said electrodes; a second heat-sink member positioned in electrical contact with another of said electrodes; and a manifold attached to said first and second heat-sink members; said manifold being formed from two pieces each of which is made from a nonconductive material, one of said pieces having a plurality of U-shaped open channels therein, the other piece of said manifold being made from a sheet material bonded to said first manifold piece, said sheet material being positioned on said first manifold piece to close said U-shaped open channels in said first piece, thereby, to form closed flow passages therein.
Claim 7
Dependent Claim
129 words
Apparatus for cooling a semiconductor device with a liquid, said device having anode and cathode electrodes, which apparatus comprises: a first heat-sink member positioned in electrical contact with one of said electrodes; a second heat-sink member positioned in electrical contact with another of said electrodes; and a manifold attached to said first and second heat-sink members; said manifold being formed from two pieces each of which is made from a nonconductive material, one of said pieces having a plurality of U-shaped open channels therein, the other piece of said manifold being made from a sheet material bonded to said first manifold piece, said sheet material being positioned on said first manifold piece to close said U-shaped open channels in said first piece, thereby, to form closed flow passages therein.
Claim 8
Dependent Claim
31 words
Apparatus in accordance with claim 5, wherein at least one of said channels in said one manifold piece is folded back and forth upon itself in an accordian-like or pleated manner.
References Cited (Backward Citations)
US3275921A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-29 | 1977-04-30 | 1977-10-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-29 | 1981-04-30 | 1981-10-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-29 | 1985-04-30 | 1985-10-30 | $7700.00 | Window Closed / Lapsed |