Etching composition preparatory to nickel plating

Abstract

Abstract ALUMINUM METALS HAVINGNICKEL COATINGS PLATED DIRECTLY THEREON MAY BE PREPARD BY ELECTROLESS DEPOSITION OF NICKEL FROM AN AQUEOUS PLATING SOLUTION CONTAINING NICKEL IONS, DIMETHYLAMINOBORANE, A CARBOXYLIC ACID COMPLEXING AGENT AND A STRESS REDUCER. NICKEL PLATED MAGNESIUM METALS AND BERYLLIUM METALS MAY BE SIMILARLY PREPARED. THE METAL SURFACE IS RENDERED SUSCEPTIBLE TO PLATING BY INITIALLY CONTACTING IT WITH A NOVEL ACTIVATING SOLUTION CONTAINING AMMONIUM BIFLUORIDE AND EITHER DIMETHYLAMINOBORANE OR NITRIC ACID, AND THEN RINSING IF NITRIC ACID IS USED. WHERE DIMETHYLAMINOBORANE IS USED IN THE ACTIVATING SOLUTION, THE METAL SURFACE IS THEREAFTER STABILIZED WITH AN AQUEOUS STABILIZING SOLUTION OF DIMETHYLAMINOBORANE. ELECTROLESS PLATING IS THEN CARRIED OUT, PRODUCING A STRESS FREE HERMETICALLY SEALED NICKEL COATING OF SUBSTANTIALLY UNIFROM THICKNESS DIRECTLY ON THE ALUMINUM META, MAGNESIUM METAL, OR BERYLLIUMMETAL SURFACE. ONCE SUCH A COATING IS ESTABLISHED, FURTHER PLATING WITH COPPER, NICKEL OR OTHER METALS MAY BE EFFECTED BY ELECTROLYTIC OR ELECTROLESS MEANS. THE NICKEL COATED SURFACE IS PRESERVED IN A PROPER STATE FOR ANY SUCH ADDITIONAL PLATING BY HOLDING IT IN AN AQUEOUS PRESERVATIVE SOLUTION OF DIMETHYLAMINOBORANE.

Inventors

• 👤 G Miller

Bibliographic Details