US3766440A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic integrated circuit convector assembly
Assignee: Motors Liquidation Co
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Filing: 1972-08-11
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Granted: 1973-10-16
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Expires: 1992-08-11
Abstract
Abstract An integrated circuit assembly which includes a ceramic substrate for thick film power circuits having a cermet circuit pattern and semiconductor dies on one generally flat face and a convector surface configuration on the opposite face.
Inventors
- 👤 D Baird
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 05:23
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W90/00; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
162 words
A hybrid integrated circuit assembly having an integral ceramic substrate and convector, said assembly comprising a substrate of a ceramic selected from the group consisting of alumina and berylia, said substrate having one substantially flat surface and a highly contoured opposite surface for heat radiation from said substrate, the minimum thickness of said substrate between said surfaces being about 0.06 - 0.1 inch, a cermet circuit pattern on said flat surface, at least one semiconductor die mount region in said circuit pattern, at least one semiconductor die attached to said circuit pattern in said region, said highly contoured opposite surface of said substrate having integral projections thereon that provide an actual surface area per unit planar area at least four times the unit planar area, said integral projections having a root width of 0.6 - 0.9 inch, a protective covering secured to said substrate over said pattern and said die, and conductive leads from said circuit pattern extending out from said covering.
Claim 2
Dependent Claim
162 words
A hybrid integrated circuit assembly having an integral ceramic substrate and convector, said assembly comprising a substrate of a ceramic selected from the group consisting of alumina and berylia, said substrate having one substantially flat surface and a highly contoured opposite surface for heat radiation from said substrate, the minimum thickness of said substrate between said surfaces being about 0.06 - 0.1 inch, a cermet circuit pattern on said flat surface, at least one semiconductor die mount region in said circuit pattern, at least one semiconductor die attached to said circuit pattern in said region, said highly contoured opposite surface of said substrate having integral projections thereon that provide an actual surface area per unit planar area at least four times the unit planar area, said integral projections having a root width of 0.6 - 0.9 inch, a protective covering secured to said substrate over said pattern and said die, and conductive leads from said circuit pattern extending out from said covering.
Claim 3
Dependent Claim
41 words
The assembly as described in claim 1 wherein the substrate is of alumina, the integral projections on said contoured opposite substrate surface are mutually parallel linear fins, and said fins project out from said opposite surface less than about 0.2 inch.
References Cited (Backward Citations)
US3404215A
Cited
US3694699A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-15 | 1977-04-16 | 1977-10-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-15 | 1981-04-16 | 1981-10-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-15 | 1985-04-16 | 1985-10-16 | $7700.00 | Window Closed / Lapsed |