Abstract An electroless copper deposit from a plating solution comprising a source of cupric ions, hydroxyl radicals, formaldehyde or a formaldehyde precursor, preferably paraformaldehyde, and a complexing agent for copper which solution is characterized by the addition of at least two members selected from the group consisting of a formaldehyde addition agent, a solution soluble salt of a Group VIII metal of the Periodic Chart of the Elements, and an organic silicon compound. The copper plate deposited from the preferred solution is alloyed with the Group VIII metal cation and is distinguishable from prior art electroless copper deposits by substantially improved bending or tensile properties and a smoother, more highly reflecting surface appearance.
The article of manufacture of claim 1 where said combination comprises the organic silicon compound, the formaldehyde addition agent and the solution soluble salt of the Group VIII metal of the Periodic Chart of the Elements.
Claim 2
Dependent Claim
32 words
The article of manufacture of claim 1 where said combination comprises the organic silicon compound and the solution soluble salt of the Group VIII metal of the Periodic Chart of the Elements.
Claim 3
Dependent Claim
22 words
The article of manufacture of claim 2 where the organic silicon compound is selected from the group consisting of silanes and polysiloxanes.
Claim 4
Dependent Claim
23 words
The article of manufacture of claim 2 where the Group VIII metal salt is selected from the group of nickel, iron and platinum.
Claim 5
Dependent Claim
19 words
The article of manuFacture of claim 1 in the form of a printed circuit board having ductile copper conductors.
Claim 6
Dependent Claim
11 words
The printed circuit board of claim 6 having copper plated through-holes.