US3764422A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of producing thin layer electronic assembly
Assignee: Siemens AG
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Filing: 1970-10-02
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Granted: 1973-10-09
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Expires: 1990-10-02
Abstract
Abstract COVERS AN IMPROVED THIN LAYER ELECTRONIC CIRCUIT ASSEMBLY FOR RECEIVING ELECTRICAL COMPONENTS WHICH INCLUDES A NON-CONDUCTIVE FLEXIBLE PLASTIC FOIL SUPPORT HAVING A THINLAYER CIRCUIT ADHERENT TO SAID SUPPORT, WHICH CIRCUIT INCLUDES CONDUCTOR TRACKS FOR RECEIVING SAID ELECTRICAL COMPONENTS AND CONTACT SURFACES FOR CONNECTION WITH OTHER CIRCUITS. IT ALSO COVERS A METHOD OF PREPARING A PLURALITY OF SAID ASSEMBLIES IN A CONTINUOUS MANNER BY PREPARING A TAPE OF SAID SUPPORT AND FIXING THEREON A PLURALTIY OF SAID THIN LAYER CIRCUITS IN A CONTINUOUS MANNER. THE TAPE THEN IS TRIMMED TO PROVIDE THE DESIRED GROUP OF CIRCUITS.
Inventors
- 👤 H Koritke
- 👤 R Haft
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:42
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/0091; B; B23; B23K; B23K1/00; B23K2101/00; B23K2101/36; H05K1/00; H05K1/16; H05K1/167; H05K1/18; H05K1/189; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10166; H05K2201/10431; H05K2201/10439; H05K2201/105; H05K2201/10568; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0165; H05K2203/16; H05K2203/166; H05K2203/167; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-08 | 1977-04-09 | 1977-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-08 | 1981-04-09 | 1981-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-08 | 1985-04-09 | 1985-10-09 | $7700.00 | Window Closed / Lapsed |