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US3762974A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for the manufacture of compressed boards

Assignee: FAHRNI P INST Ltd
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Filing: 1971-10-14
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Granted: 1973-10-02
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Expires: 1991-10-14
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Abstract

Abstract The object of the present invention is a method of producing compressed boards by the hot pressing of board preforms from particles treated with a thermosetting binder. The field of use is primarily for the manufacture of wood chip boards,but other fields are also important.

Inventors

  • 👤 W Wirz

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 11:21
CPC Classifications
B; B27; B27N; B27N3/00; B27N3/08; B27N3/10

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 27 words
Method according to claim 1 characterized by such a hot pressing of the thin support layers that the lower side becomes smooth and the upper side rough.
Claim 2
Dependent Claim 33 words
Method according to claim 1 characterized by the fact that the hot pressing of the thin support layers is interrupted before the binder, with which the particles have been treated, has been cured.
Claim 3
Dependent Claim 40 words
Method according to claim 1 characterized by the fact that the upper sides of the thin support layers are strewn with a liquid or pulverulent binder before the strewing of the particles intended for the formation of the board preforms.
Claim 4
Dependent Claim 54 words
Method according to claim 1 for the manufacture of multi-layer boards with top layers of particles which are thinner than the core layer material characterized by the fact that for the formation of the precompacted support layers there is used a part of the particles provided for the production of the lower outer layer.
Claim 5
Dependent Claim 163 words
Method of producing compressed boards by hot pressing of board preforms consisting of particles treated with a thermosetting binder particularly for the manufacture of wood chip boards characterized by the fact that initially webs, which are thin as compared with the thickness of the board preforms, are formed from particles whereupon these webs are compacted by hot pressing to such an extent that the binder is at least partially set, and that thereupon the board preforms proper are formed by the strewing of particles onto these thin support layers which have been precompacted in this manner, and the boards are produced by hot pressing and combining of support layers and of board preforms, and characterized by the fact that the precompacted support layers serve as strewing, transporting, and pressing supports for the board preforms; and further characterized by the fact that the support layers charged with the board preforms are pulled by means of grippers of a conveyor device over a stationary support.
Claim 6
Dependent Claim 81 words
Method according to claim 6 characterized by the fact that the precompacted support layers are arranged in a row alongside of each other before the formation of the actual preforms in such a manner that the support layers partially overlap, and that after the strewing of an endless preform the latter is so cut that, after the pulling apart of the support layers, a front section, seen in the direction of movement, of each support layer is not covered with particles.
Claim 7
Dependent Claim 137 words
Method of producing compressed boards by hot pressing of board preforms which include particles mixed with a thermosetting binder including the following steps: spreading fine particles mixed with a thermosetting binder on a base at a first position and compacting by hot pressing to partially set the binder, thereby forming a series of support layers; transporting said layers to a second position and producing a partial overlap of the layers adjacent their ends; spreading coarse particles mixed with a thermosetting binder on said layers to produce an endless preform; spreading fine particles on the coarse particles; cutting the coarse and fine layers at a position adjacent the overlap of the base layers; pulling the base layers apart; and hot compacting the separated boards to produce a series of particle boards compacted with a fully set thermosetting binder.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-10-01 1977-04-02 1977-10-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-10-01 1981-04-02 1981-10-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-10-01 1985-04-02 1985-10-02 $7700.00 Window Closed / Lapsed

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