Molding compositions containing silanol free resins
Abstract
Abstract A SILICONE MOLDING COMPOSITION HAVING IMPROVED THERMAL SHOCK RESISTANCE HAVING AS ITS MAIN INGREDIENTS A SILICONE RESIN OF A HIGH SILANOL CONTENT, THAT IS, A SILANOL CONTENT OF 3 TO 11% BY WEIGHT OF THE RESIN, AND A LOW SILONOL CONTENT RESIN HAVING LESS THAN .5 WEIGHT PERCENT OF SILANOL GROUPS AND PREFERABLY BEING SUBSTANTIALLY SILANOL-FREE. THE MOLDING COMPOSITION IS PREPARED BY MIXING THE LOW CONTENT SILANOL RESIN WITH A FILLER AND THEN ADDING TO THE MIXTURE PIGMENT, CATALYST SYSTEM, A PROCESS AID AND A RELEASE AGENT. TO THIS RESULTING MIXTURE THERE IS THEN ADDED THE HIGH SILANOL CONTENT BINDER RESIN AND ADDITIONAL FILLER, SUCH AS GLASS FIBERS. THE RESULTING MIXTURE IS EXTRUDED TO A SHEET WHICH IS THEN GROUND INTO FINE PARTICLES, THE FINE PARTICLES BEING AN UNCURED MOLDING RESIN COMPOSITION.
Inventors
- 👤 D Merrill
- 👤 R Cooke
Bibliographic Details
Claims Analysis
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