US3757175A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tor chips mounted on a single substrate composite integrated circuits with coplnaar connections to semiconduc
Assignee: Individual
•
Filing: 1971-01-06
•
Granted: 1973-09-04
•
Expires: 1991-01-06
Abstract
Abstract Integrated circuits in which individual semiconductor chips exhibiting diverse electrical and compositional characteristics may in combination with thin or thick film passive components be applied to a single flat supporting dielectric substrate, wherein there are provided readily formed connections to the chips and an ease of registration of the chips with respect to one another and to conductive patterns carried by the substrate. The chips are bonded to the dielectric substrate and embedded in a smooth layer of chemically inert, high quality insulating material adhering to the substrate, said chips being applied with the metalized surface thereof contiguous with that of the insulating material so that a continuous supporting structure is formed for said connection. In one specific embodiment, the conductive patterns are deposited both on the substrate surface and on the surface of the insulating material, the patterns being connected by extending portions thereof through the insulating layer.
Inventors
- 👤 Soo Kim Chang
- 👤 G Palmer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 07:52
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H10W70/60; H10W70/611; H10W90/00; Y; Y10; Y10S; Y10S148/00; Y10S148/085
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
18 words
An integrated circuit structure as in claim 1 wherein said insulating layer is composed of a plastic material.
Claim 2
Dependent Claim
39 words
An integrated circuit structure as in claim 1 that includes registration means arranged around the site on the substrate to which said electronic component is bonded for providing linear and radial registration of the electronic component on said substrate.
Claim 3
Dependent Claim
71 words
An integrated circuit structure as in claim 1 wherein at least part of said conductive pattern includes further strips of electrically conductive material deposited directly on the substrate beneath said layer of insulating material, said terminal members being formed by a first plurality of terminal mesa structures which are built upon the further conductive strips and extend through said insulating layer so as to be contiguous with said insulating layer surface.
Claim 4
Dependent Claim
71 words
An integrated circuit structure as in claim 4 wherein certain of said further conductive strips are discontinuous as deposited on said substrate, which includes a second plurality of terminal mesa structures built upon said discontinuous conductive strips and a second plurality of strips of electrically conductive material overlaying said insulating layer that make electrical connections between said second plurality of terminal mesa structures for providing crossover connections within said conductive pattern.
Claim 5
Dependent Claim
23 words
An integrated circuit structure as in claim 3 wherein said registration means includes a plurality of registration mesa structures built upon said substrate.
Claim 6
Dependent Claim
28 words
An integrated circuit structure as in claim 5 wherein said terminal mesa structures are thick film formations of electrically conductive material that have been electroplated by photolithographic techniques.
Claim 7
Dependent Claim
36 words
An integrated circuit structure as in claim 6 wherein a plurality of electronic components are bonded to said substrate and interconnected by said conductive pattern, said conductive pattern including a plurality of film type passive components.
Claim 8
Dependent Claim
23 words
An integrated circuit structure as in claim 8 wherein said insulating layer is composed of a fluorinated plastic that is highly chemically inert.
Claim 9
Dependent Claim
51 words
An integrated circuit structure as in claim 9 wherein said layer of insulating material is at least one mil thick and said electronic components having a thickness slightly less than that of said layer are embedded within said layer face up with said contact electrodes contiguous with said insulating layer surface.
Claim 10
Dependent Claim
52 words
An integrated circuit structure as in claim 2 wherein said substrate includes a relatively broad mesa formation, said electronic component being bonded at the surface of said insulating layer in registration with said broad mesa formation, said electronic component being bonded face down with said contact electrodes of said insulating layer surface.
Claim 11
Dependent Claim
42 words
An integrated circuit structure as in claim 1 wherein said layer of insulating material is on the order of several microns, said electronic component being bonded at the surface of said insulating layer face down with said contact electrodes on said surface.
Claim 12
Dependent Claim
31 words
An integrated circuit structure as in claim 12 wherein said conductive pattern is deposited on said insulating layer surface, said terminal members being composed of said portions of said conductive patterns.
Claim 13
Dependent Claim
36 words
An integrated circuit structure as in claim 13 wherein a plurality of electronic components are bonded to said substrate and interconnected by said conductive pattern, said conductive pattern including a plurality of film type passive components.
Claim 14
Dependent Claim
23 words
An integrated circuit structure as in claim 14 wherein said dielectric layer is composed of a fluorinated plastic that is highly chemically inert.
Claim 15
Dependent Claim
141 words
An integrated circuit structure comprising: a. a dielectric substrate having a substantially planar surface area, b. an electronic component having a number of contact electrodes, said electronic compoNent being mounted on said substrate so that said contact electrodes are upwardly facing and elevated with respect to said substantially planar surface area, c. a layer of insulating material in intimate contact with and surrounding said electronic component and contiguous with the surfaces of said contact electrodes, d. strips of deposited electrically conductive film material continuously supported along their length by said insulating material for making electrical connection to said contact electrodes, and e. a deposited conductive pattern supported on said substrate and having conductive means extending through said layer so as to be contiguous with the surface of said insulating material for making electrical connection between said strips and said conductive pattern.
Claim 16
Dependent Claim
23 words
An integrated circuit structure as in claim 16 wherein said conductive means are terminal mesa structures which are formed upon said conductive pattern.
Claim 17
Dependent Claim
46 words
An integrated circuit structure as in claim 17 which includes registration means in the form of an embossed structure arranged around the site on the substrate to which said electronic component is bonded for providing linear and radial registration of the electronic component on said substrate.
Claim 18
Dependent Claim
25 words
An integrated circuit structure as in claim 18 wherein said dielectric material has adhesive properties and serves to bond said electronic component to said substrate.
Claim 19
Dependent Claim
21 words
An integrated circuit structure as in claim 19 wherein said dielectric material is a fluorinated plastic that is highly chemically inert.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-09-03 | 1977-03-05 | 1977-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-09-03 | 1981-03-05 | 1981-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-09-03 | 1985-03-05 | 1985-09-04 | $7700.00 | Window Closed / Lapsed |