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US3757127A Expired / Lapsed US ⏱️ 0.0 years remaining

Photodetector packing assembly

Assignee: Cogar Corp
•
Filing: 1970-08-10
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Granted: 1973-09-04
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Expires: 1990-08-10
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Abstract

Abstract A photodetector assembly includes a slice of semiconductive material having a photodetector array formed thereon. The slice is supported on a substrate. A fiber optics bundle is closely spaced and coupled optically to the devices of the array. In one embodiment, the substrate is apertured. Contacts space the slice from the substrate with the array positioned over the aperture. The bundle extends into the aperture, terminating at the surface of the substrate. In another embodiment the slice is bonded to a depression in the substrate with the array facing away from the substrate. An apertured cap is mounted over the substrate, with the bundle extending into the aperture.

Inventors

  • 👤 V Dhaka

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 09:18
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; G; G01; G01J; G01J1/00; G01J1/02; G01J1/04; G01J1/0407; G01J1/0425; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 169 words
A photodetector packaging assembly comprising: a dielectric substrate; a slice of semiconductive material supported on said substrate, said slice including a photodetector array located thereon, said photodetector array having a plurality of photoresponsive elements, a fiber optics bundle comprising optic elements being closely spaced and optically coupled to said photodetector array, each of said elements of said fiber optics bundle being in alignment with one of said photoresponsive elements of said photodetector array, means for positioning said slice with respect to said fiber optics bundle to permit each of said fibers of said fiber optics bundle to be in alignment with one of said photoresponsive elements of said photodetector array, said means comprising solder means for connecting said slice to said substrate and for aligning elements of said photoresponsive elements to respective fibers of said elements optics bundle, said substrate being apertured, said semiconductive slice being spaced from said substrate over said aperture with said array positioned over and facing said aperture and said Bundle extending into said aperture.
Claim 2
Dependent Claim 169 words
A photodetector packaging assembly comprising: a dielectric substrate; a slice of semiconductive material supported on said substrate, said slice including a photodetector array located thereon, said photodetector array having a plurality of photoresponsive elements, a fiber optics bundle comprising optic elements being closely spaced and optically coupled to said photodetector array, each of said elements of said fiber optics bundle being in alignment with one of said photoresponsive elements of said photodetector array, means for positioning said slice with respect to said fiber optics bundle to permit each of said fibers of said fiber optics bundle to be in alignment with one of said photoresponsive elements of said photodetector array, said means comprising solder means for connecting said slice to said substrate and for aligning elements of said photoresponsive elements to respective fibers of said elements optics bundle, said substrate being apertured, said semiconductive slice being spaced from said substrate over said aperture with said array positioned over and facing said aperture and said Bundle extending into said aperture.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-09-03 1977-03-05 1977-09-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-09-03 1981-03-05 1981-09-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-09-03 1985-03-05 1985-09-04 $7700.00 Window Closed / Lapsed

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