Target mounting device for sequential sputtering
Abstract
Abstract An improved target mounting device provides capability for sputter etch precleaning of substrates followed by sputtering deposition from a number of targets in sequence in a vacuum chamber of relatively small diameter without moving the substrate support or requiring movable shutters. The mounting device holds the targets in spaced angular location relative to an axis of rotation such that each target in sequence faces a substrate support when the mounting device is rotated through a corresponding plurality of angular positions about its axis. The mounting device is preferably in the form of a polygonal turret head mounted on a rotable tubular shaft. The shaft projects through the chamber wall and carries a commutator on its outer end for selectively connecting a source of electrical energy to each of the targets in turn as they rotate to face the substrate support.
Inventors
- 👤 S Hurwitt
Bibliographic Details
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-09-03 | 1977-03-05 | 1977-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-09-03 | 1981-03-05 | 1981-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-09-03 | 1985-03-05 | 1985-09-04 | $7700.00 | Window Closed / Lapsed |