US3754169A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Rectifier bridge
Assignee: General Electric Co
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Filing: 1970-02-02
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Granted: 1973-08-21
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Expires: 1990-02-02
Abstract
Abstract A rectifier bridge assembly is mounted against a heat receiving surface which may be a housing of an alternator. The bridge assembly includes a plurality of stacks each including an input lead located between junction containing semiconductor elements. A plate overlies the stacks in electrically conductive relation thereto to form a conduction path for rectified current. A dielectric surrounds the senuconductor elements to protect them against contamination.
Inventors
- 👤 R Lyon
- 👤 P Koenig
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 22:04
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H02; H02K; H02K11/00; H02K11/04; H02K11/049; H02K11/05; H10D; H10D99/00; H10W90/00; Y; Y10; Y10S; Y10S257/00; Y10S257/909
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
224 words
The combination comprising first and second spaced parallel semiconductive discs each having inner and outer major planar surfaces, said inner surfaces lying in opposed, spaced parallel relation, said first semiconductive disc being of P type conductivity and having laterally spaced N type conductivity regions adjacent said inner surface each forming separate rectifying junctions within said P type conductivity disc, said second semiconductive disc being of N type conductivity and having laterally spaced P type conductivity regions adjacent said inner surface thereof each forming separate rectifying junctions within said N type conductivity disc, said P type regions in said second semiconductive disc being aligned with said N type regions in said first semiconductive element., electrically conductive means interposed between and contacting said inner major surfaces of said semiconductive discs including a separate planar contact member interposed between said inner major surfaces contacting each aligned pair of N type and P type conductivity regions in said first and second semiconductive discs, respectively, over opposed surfaces thereof to deliver an alternating current thereto, first and second means overlying the outer surfaces of said semiconductive discs in electrically conductive relation thereto, said first means overlying one of said outer surfaces being thermally conductive and serving as the major heat removal path from said semiconductive discs, and means peripherally surrounding said semiconductive discs to protect said discs against contamination.
Claim 2
Dependent Claim
224 words
The combination comprising first and second spaced parallel semiconductive discs each having inner and outer major planar surfaces, said inner surfaces lying in opposed, spaced parallel relation, said first semiconductive disc being of P type conductivity and having laterally spaced N type conductivity regions adjacent said inner surface each forming separate rectifying junctions within said P type conductivity disc, said second semiconductive disc being of N type conductivity and having laterally spaced P type conductivity regions adjacent said inner surface thereof each forming separate rectifying junctions within said N type conductivity disc, said P type regions in said second semiconductive disc being aligned with said N type regions in said first semiconductive element., electrically conductive means interposed between and contacting said inner major surfaces of said semiconductive discs including a separate planar contact member interposed between said inner major surfaces contacting each aligned pair of N type and P type conductivity regions in said first and second semiconductive discs, respectively, over opposed surfaces thereof to deliver an alternating current thereto, first and second means overlying the outer surfaces of said semiconductive discs in electrically conductive relation thereto, said first means overlying one of said outer surfaces being thermally conductive and serving as the major heat removal path from said semiconductive discs, and means peripherally surrounding said semiconductive discs to protect said discs against contamination.
Claim 3
Dependent Claim
76 words
The combination according to claim 1 in which said peripheral means for protecting said discs against contamination is comprised of unitary passivant means, said first and second overlying means are comprised of first and second plates overlying said outer major surfaces of said first and second semiconductive discs, respectively, and said unitary passivant means is sealingly associated with said plates so that said unitary passivant means and said plates completely surround and package said semiconductive discs.
Claim 4
Dependent Claim
174 words
A rectifier bridge sub-assembly comprising a dielectric substrate having first and second opposed major surfaces and a plurality of spaced conductors therein extending between said major surfaces, a plurality of conductive strips adhered to each major surface of the substrate extending laterally therealong from a point engaging a conductor to a point remote therefrom, separate semiconductive pellet means associated with each conductive strip at a point remote from the associated conductor, each of said separate semiconductive pellet means including a separate semiconductive element having regions of opposite conductivity type forming a junction therebetween, electrically conductive contact means overlying said semiconductive element, and dielectric passivant means peripherally surrounding Said semiconductive element and cooperating with said contact means and strip to sealingly encase said element, said semiconductive elements associated with opposite surfaces of said substrate having regions of opposite conductivity type in contact with said conductive strips, and each of said conductors being associated with one conductive strip on each of said opposed major surfaces and being adapted for association with alternating current electrical input leads.
Claim 5
Dependent Claim
174 words
A rectifier bridge sub-assembly comprising a dielectric substrate having first and second opposed major surfaces and a plurality of spaced conductors therein extending between said major surfaces, a plurality of conductive strips adhered to each major surface of the substrate extending laterally therealong from a point engaging a conductor to a point remote therefrom, separate semiconductive pellet means associated with each conductive strip at a point remote from the associated conductor, each of said separate semiconductive pellet means including a separate semiconductive element having regions of opposite conductivity type forming a junction therebetween, electrically conductive contact means overlying said semiconductive element, and dielectric passivant means peripherally surrounding Said semiconductive element and cooperating with said contact means and strip to sealingly encase said element, said semiconductive elements associated with opposite surfaces of said substrate having regions of opposite conductivity type in contact with said conductive strips, and each of said conductors being associated with one conductive strip on each of said opposed major surfaces and being adapted for association with alternating current electrical input leads.
Claim 6
Dependent Claim
85 words
A rectifier bridge sub-assembly according to claim 3 in which said dielectric substrate is provided with a central aperture and said sub-assembly additionally includes a housing having a central aperture providing an electrically conductive engagement with each of said contact means associated with said semiconductive pellet means adjacent one of said major surfaces and means extending through the apertures for relatively positioning said housing and said substrate and for mounting said contact means not associated with said housing in engagement with a heat receiving substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-08-20 | 1977-02-19 | 1977-08-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-08-20 | 1981-02-19 | 1981-08-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-08-20 | 1985-02-19 | 1985-08-21 | $7700.00 | Window Closed / Lapsed |