US3753046A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-layer printed circuit board
Assignee: COMPUTING CO, University of
•
Filing: 1971-11-03
•
Granted: 1973-08-14
•
Expires: 1991-11-03
Abstract
Abstract A method and apparatus is disclosed for routing and interconnecting insulated wire to selected areas on a printed circuit board. The apparatus comprises a printed circuit board having land pads located thereon. A wire mat, comprising a quantity of routed wire encapsulated within a layer of photopolymer material, is adapted to extend over the circuit board. The wire mat also includes a plurality of windows formed in areas extending over the land pads in order to permit the wire exposed in those areas to be reflow soldered to the registering land pads. The method of forming the wire mat and the multi-layer printed circuit board comprises the steps of prerouting the insulated wire on a jig board and encapsulating the wire with a quantity of light sensitive photopolymer material. After the windows are formed by washing away masked portions of the photopolymer material, the soldering connections are all made simultaneously.
Inventors
- 👤 L Towell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:10
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/06; H05K3/00; H05K3/22; H05K3/222; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/30; H05K3/301; Y; Y10; Y10S; Y10S428/00; Y10S428/901
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
173 words
A multi-layered circuit board adapted to accommodate integrated circuit units comprising: a printed board having a plurality of wire land areas and integrated circuit land areas mounted on its surface; a sheet of conducting material adapted to provide a voltage source connected to the printed board; means for providing a ground plane; and a layer of photopolymer material including a wire mat, the wire of the mat having a predetermined pattern encapsulated in the layer, the photopolymer layer having at least a first opening aligned with at least some of the wire land areas with at least some of the wires extending out of one surface of the photopolymer layer in the side of the opening and extending across the opening into the other side surface of the photopolymer layer, at least some of the wires electrically connected to the wire land areas, the photopolymer layer further having at least a second opening adapted to extend over the integrated circuit land areas whereby integrated circuit units can be attached to the printed board.
Claim 2
Dependent Claim
173 words
A multi-layered circuit board adapted to accommodate integrated circuit units comprising: a printed board having a plurality of wire land areas and integrated circuit land areas mounted on its surface; a sheet of conducting material adapted to provide a voltage source connected to the printed board; means for providing a ground plane; and a layer of photopolymer material including a wire mat, the wire of the mat having a predetermined pattern encapsulated in the layer, the photopolymer layer having at least a first opening aligned with at least some of the wire land areas with at least some of the wires extending out of one surface of the photopolymer layer in the side of the opening and extending across the opening into the other side surface of the photopolymer layer, at least some of the wires electrically connected to the wire land areas, the photopolymer layer further having at least a second opening adapted to extend over the integrated circuit land areas whereby integrated circuit units can be attached to the printed board.
Claim 3
Dependent Claim
23 words
The invention of claim 1 wherein the sheet of conducting material is positioned between the printed board and the layer of photopolymer material.
Claim 4
Dependent Claim
14 words
The invention of claim 1 wherein said wire include an outer layer of insulation.
Claim 5
Dependent Claim
15 words
The invention of claim 1 wherein said encapsulating material comprises a light sensitive photopolymer material.
Claim 6
Dependent Claim
21 words
The invention of claim 1 wherein said wire land areas are formed by conventionally etched foil techniques and plated with solder.
Claim 7
Dependent Claim
22 words
The invention of claim 1 wherein said integrated circuit land areas are formed by conventionally etched foil techniques and plated with solder.
Claim 8
Dependent Claim
13 words
The invention of claim 1 further comprising means for insulating said wire mat.
Claim 9
Dependent Claim
22 words
The invention of claim 1 wherein said sheet of conducting material comprises a layer of insulative material having current conductors mounted thereon.
Claim 10
Dependent Claim
33 words
The invention of claim 1 wherein said wire land areas are mounted on both sides of the printed board, and an encapsulated wire mat is located on both sides of the printed board.
Claim 11
Dependent Claim
30 words
The invention of claim 2 wherein the means for providing a ground plane includes a sheet of conducting material positioned between the printed board and the layer of photopolymer material.
Claim 12
Dependent Claim
38 words
The invention of claim 2 wherein some of the wires in the first opening extend towards the printed board from the side surface of the first opening while others extend parallel to the printed board across the opening.
Claim 13
Dependent Claim
18 words
The invention of claim 11 wherein the second opening does not have any wires extending across the opening.
Claim 14
Dependent Claim
30 words
The invention of claim 12 wherein said printed circuit board further comprises a plurality of dual inline packages having a plurality of legs extending through the second group of windows.
Claim 15
Dependent Claim
39 words
The invention of claim 12 wherein said wire land areas and said integrated circuit land areas are electrically interconnected, via a narrower heat flow restriction, to impead the heat transfer from one wire land to the other wire land.
Claim 16
Dependent Claim
25 words
The invention of claim 14 wherein said wire land areas and said integrated circuit land areas are arranged in parallel rows on said printed board.
Claim 17
Dependent Claim
33 words
The invention of claim 7 wherein said insulation means comprises a pair of ground planes located on both sides of said wire mat, each ground plane having an exterior layer of insulative material.
Claim 18
Dependent Claim
24 words
The invention of claim 16 wherein the ground planes further comprise ground leads on the interior sides thereof contacting selected integrated circuit land areas.
Claim 19
Dependent Claim
219 words
A multi-layered circuit board adapted to accommodate integrated circuit units comprising: a printed board having a plurality of wire land areas and integrated circuit land areas mounted on its surface; a layer of photopolymer material including a wire mat, the wire of the mat having a predetermined pattern encapsulated in the layer, the photopolymer layer having at least a first opening aligned with at least some of the wire land areas with at least some of the wires extending out of one surface of the photopolymer layer in the side of the opening and extending across the opening into the other side surface of the photopolymer layer, at least some of the wires electrically connected to the wire land areas, the photopolymer layer further having at least a second opening free from any wires across the opening adapted to extend over the integrated circuit land areas whereby integrated circuit units can be attached to the printed board, a sheet of insulated conducting material positioned on the surface of the printed board and between the printed board and the layer of photopolymer material adapted to provide a voltage source connected to the printed board; and a pair of grounD planes located on both sides of the layer of photopolymer material, each ground plane having an exterior layer of insulative material.
Claim 20
Dependent Claim
219 words
A multi-layered circuit board adapted to accommodate integrated circuit units comprising: a printed board having a plurality of wire land areas and integrated circuit land areas mounted on its surface; a layer of photopolymer material including a wire mat, the wire of the mat having a predetermined pattern encapsulated in the layer, the photopolymer layer having at least a first opening aligned with at least some of the wire land areas with at least some of the wires extending out of one surface of the photopolymer layer in the side of the opening and extending across the opening into the other side surface of the photopolymer layer, at least some of the wires electrically connected to the wire land areas, the photopolymer layer further having at least a second opening free from any wires across the opening adapted to extend over the integrated circuit land areas whereby integrated circuit units can be attached to the printed board, a sheet of insulated conducting material positioned on the surface of the printed board and between the printed board and the layer of photopolymer material adapted to provide a voltage source connected to the printed board; and a pair of grounD planes located on both sides of the layer of photopolymer material, each ground plane having an exterior layer of insulative material.
References Cited (Backward Citations)
DE1085207B
Cited
US3002095A
Cited
US3366519A
Cited
US3478425A
Cited
US3646572A
Cited
US3626086A
Cited
US3644792A
Cited
US3628095A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-08-13 | 1977-02-12 | 1977-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-08-13 | 1981-02-12 | 1981-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-08-13 | 1985-02-12 | 1985-08-14 | $7700.00 | Window Closed / Lapsed |