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US3749619A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for manufacturing a semiconductor integrated circuit isolated by dielectric material

Assignee: Toshiba Corp
•
Filing: 1971-06-21
•
Granted: 1973-07-31
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Expires: 1991-06-21
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Abstract

Abstract A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT COMPRISES STEPS OF SELECTIVILY EPITAXIAL-GROWING ISLAND REGIONS ON THE UPPER SURFACE OF A SILICON SUBSTRATE, COVERING SAID ISLAND REGIONS AND THE UPPER SURFACE OF THE SUBSTRATE, FORMING A SILICON LAYER ON SAID INSULATING FILM AND ETCHING THE SILICON SUBSTRATE WITH AN ETCHANT OF HF, HNO3 AND CH3COOH WHICH SELECTIVELY ETCHES THE SILICON SUBSTRATE WITHOUT ETCHING THE ISLAND REGION.

Inventors

  • 👤 T Ohashi
  • 👤 Y Sumitomo
  • 👤 H Muraoka
  • 👤 H Tsutsumi
  • 👤 T Yasui

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 22:47
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/60; H10P50/64; H10P50/642; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/019; H10W10/10; Y; Y10; Y10S; Y10S148/00; Y10S148/026; Y10S148/043; Y10S148/051; Y10S148/085

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-07-30 1977-01-29 1977-07-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-07-30 1981-01-29 1981-07-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-07-30 1985-01-29 1985-07-31 $7700.00 Window Closed / Lapsed

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