US3748546A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photosensitive device and array
Assignee: Signetics Corp
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Filing: 1969-05-12
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Granted: 1973-07-24
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Expires: 1989-05-12
Abstract
Abstract Photosensitive device having a back side surface which is provided with a substantially transparent insulating layer and at least a portion of which is exposed through the layer so that light can enter the phototransistor through the back side. In the array, a plurality of the photosensitive devices are provided in a predetermined pattern.
Inventors
- 👤 D Allison
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 09:43
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/197; H10F99/00; H10W90/00; H10W90/10
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
151 words
In a photosensitive assembly, at least one photosensitive device, each device comprising a body of semiconductor material having a front side surface and a back side surface, said body having a region of one conductivity type formed therein, a region of a second conductivity type formed within said first region of the body and providing a first P-N junction which extends to the front side surface, an insulating layer covering said front side surface, and contact means extending through said insulating layer and making contact with said first and second regions, a layer of substantially transparent insulating material covering the back side surface of said body, a layer of opaque material disposed on said substantially transparent insulating material, said layer of opaque material having an opening formed therein to permit light to pass through a portion of said substantially transparent insulating material and enter the semiconductor material from the back side.
Claim 2
Dependent Claim
151 words
In a photosensitive assembly, at least one photosensitive device, each device comprising a body of semiconductor material having a front side surface and a back side surface, said body having a region of one conductivity type formed therein, a region of a second conductivity type formed within said first region of the body and providing a first P-N junction which extends to the front side surface, an insulating layer covering said front side surface, and contact means extending through said insulating layer and making contact with said first and second regions, a layer of substantially transparent insulating material covering the back side surface of said body, a layer of opaque material disposed on said substantially transparent insulating material, said layer of opaque material having an opening formed therein to permit light to pass through a portion of said substantially transparent insulating material and enter the semiconductor material from the back side.
Claim 3
Dependent Claim
35 words
A photosensitive assembly as in claim 1 together with a third region of said one conductivity type formed in said second region and providing a second P-N junction which extends to said front side surface.
Claim 4
Dependent Claim
18 words
A photosensitive assembly as in claim 1 wherein said contact means is in the form of beam leads.
Claim 5
Dependent Claim
28 words
A photosensitive assembly as in claim 1 wherein said contact means is in theform of metallization deposited on said layer of insulating material the form said front surface.
Claim 6
Dependent Claim
47 words
A photosensitive assembly as in claim 1 wherein a plurality of said devices are provided which are dielectrically isolated from each other by said substantially transparent insulating layer and wherein said layer of opaque material functions as support means for supporting the devices in a unitary assembly.
Claim 7
Dependent Claim
65 words
A photosensitive assembly as in claim 5 wherein said layer of opaque material is in the form of a solid mass covering the substantially transparent insulating layer on the back sides of the devices and wherein said layer of opaque material has openings formed therein to permit light to pass through portions of said substantially transparent insulating layer for at least certain of the devices.
Claim 8
Dependent Claim
56 words
A photosensitive assembly as in claim 1 wherein a plurality of said devices are provided which are dielectrically isolated from each other by said substantially transparent insulating material, and wherein said contact means is in the form oF beam leads and said beam leads serve as support means for supporting the devices in a unitary assembly.
Claim 9
Dependent Claim
36 words
A photosensitive assembly as in claim 7 wherein said layer of opaque material is in the form of a metal, said layer of metal being formed so that each device is isolated from the other devices.
Claim 10
Dependent Claim
35 words
A photosensitive assembly as in claim 5 wherein said openings in said layer of opaque material are substantially smaller in size than the devices and wherein the openings are centered with respect to the devices.
Claim 11
Dependent Claim
152 words
In a photosensitive array, a plurality of islands of semiconductor material having a front side surface and a back side surface, means carried by the back sides of each island for dielectrically isolating the islands from each other, each of said islands having a first region of one conductivity type and a second region of an opposite conductivity type within said first region and providing a first P-N junction which extends to the front side surface, contact means on the front side making contact with said first and second regions, said layer of insulating material carried by the back side of each of the islands being substantially transparent a layer of opaque material disposed on said substantially transparent insulating material, said layer of opaque material having selected openings formed therein to permit light to pass through portions of said substantially transparent insulating material and enter the semiconductor material from the back side.
Claim 12
Dependent Claim
152 words
In a photosensitive array, a plurality of islands of semiconductor material having a front side surface and a back side surface, means carried by the back sides of each island for dielectrically isolating the islands from each other, each of said islands having a first region of one conductivity type and a second region of an opposite conductivity type within said first region and providing a first P-N junction which extends to the front side surface, contact means on the front side making contact with said first and second regions, said layer of insulating material carried by the back side of each of the islands being substantially transparent a layer of opaque material disposed on said substantially transparent insulating material, said layer of opaque material having selected openings formed therein to permit light to pass through portions of said substantially transparent insulating material and enter the semiconductor material from the back side.
Claim 13
Dependent Claim
38 words
An array as in claim 10 wherein at least certain of the islands have a third region of said one conductivity type formed within said second region to provide a second P-N junction which extends to the surface.
Claim 14
Dependent Claim
51 words
An array as in claim 11 wherein said islands are disposed in a predetermined pattern and wherein only a portion of said islands have openings formed in the layer of opaque material overlying the transparent insulating material on their back side in order to provide a predetermined code with the array.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-07-23 | 1977-01-22 | 1977-07-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-07-23 | 1981-01-22 | 1981-07-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-07-23 | 1985-01-22 | 1985-07-24 | $7700.00 | Window Closed / Lapsed |