US3746947A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1970-03-10
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Granted: 1973-07-17
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Expires: 1990-03-10
Abstract
Abstract A flat semiconductor element disposed within a hollow cylindrical insulation has its main opposite faces each in pressure contact with a smaller end face of an electrodes in the form of truncated hollow cone closing each end of the insulation. The electrode is provided at the smaller end with a resilient flange welded to a resilient flange on the adjacent end of the insulation and has many protrusion extend from the recessed larger end portion for cooling purpose. A cover can seal the larger end portion to circulate a coolant around the protrusions.
Inventors
- 👤 I Yamamoto
- 👤 M Ueda
- 👤 Y Yoneda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 23:08
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10W40/00; H10W40/40; H10W40/47
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
350 words
A semiconductor device comprising: a hollow cylindrical member composed of electrically insulating material open at both ends; a pair of electrode blocks disposed to hermetically close both open ends of said hollow cylindrical member to define a sealed space therebetween interiorly of said cylindrical member; and a semiconductor element having a pair of opposite main faces and disposed in said sealed space supported by said electrode blocks therebetween; wherein at least one of said electrode blocks comprises a one-piece unitary structure having the configuration of a truncated cone having a smaller diameter portion and a larger diameter portion, said smaller diameter portion extending into the associated open end portion of said hollow cylindrical member and having its end surface in contact with the adjacent one of said main faces of said semiconductor element and wherein said smaller diameter portion is provided on a peripheral surface portion thereof with a flange welded to a flange disposed on the adjacent open end of said hollow cylindrical member, and wherein said larger diameter portion has an outside diameter greater than that of the open end of said hollow cylindrical member and ispositiioned outside of said cylindrical member and wherein said larger diameter portion is provided at the free end thereof with means therein defining a recess and a plurality of protrusions extending outwardly from the surface of said recess defining with the remainder of said one electrode block a one-piece unitary structure free of metallic interfaces therebetween, and wherein said smaller and larger diameter portions are interconnected by a frusto-conical surface disposed therebetween; and electrically conductive covering means covering said plurality of protrusions and directly contacting at least some of said protrusions to define an electric current path from said covering means through the protrusions to said semiconductor element and wherein said covering means cooperates with said larger diameter portion to define a sealed space containing wherein said plurality of protrusions, and means defining inlet and outlet openings in said covering means for effecting circulation of a cooling medium through said sealed space and around said protrusions during use of the semiconductor device.
Claim 2
Dependent Claim
350 words
A semiconductor device comprising: a hollow cylindrical member composed of electrically insulating material open at both ends; a pair of electrode blocks disposed to hermetically close both open ends of said hollow cylindrical member to define a sealed space therebetween interiorly of said cylindrical member; and a semiconductor element having a pair of opposite main faces and disposed in said sealed space supported by said electrode blocks therebetween; wherein at least one of said electrode blocks comprises a one-piece unitary structure having the configuration of a truncated cone having a smaller diameter portion and a larger diameter portion, said smaller diameter portion extending into the associated open end portion of said hollow cylindrical member and having its end surface in contact with the adjacent one of said main faces of said semiconductor element and wherein said smaller diameter portion is provided on a peripheral surface portion thereof with a flange welded to a flange disposed on the adjacent open end of said hollow cylindrical member, and wherein said larger diameter portion has an outside diameter greater than that of the open end of said hollow cylindrical member and ispositiioned outside of said cylindrical member and wherein said larger diameter portion is provided at the free end thereof with means therein defining a recess and a plurality of protrusions extending outwardly from the surface of said recess defining with the remainder of said one electrode block a one-piece unitary structure free of metallic interfaces therebetween, and wherein said smaller and larger diameter portions are interconnected by a frusto-conical surface disposed therebetween; and electrically conductive covering means covering said plurality of protrusions and directly contacting at least some of said protrusions to define an electric current path from said covering means through the protrusions to said semiconductor element and wherein said covering means cooperates with said larger diameter portion to define a sealed space containing wherein said plurality of protrusions, and means defining inlet and outlet openings in said covering means for effecting circulation of a cooling medium through said sealed space and around said protrusions during use of the semiconductor device.
Claim 3
Dependent Claim
257 words
A semiconductor device comprising: a hollow cylindrical member composed of electrically insulating material and having a pair of open ends; a semiconductor element disposed interiorly of said hollow cylindrical member; a pair of electrode blocks each positioned in one of said pair of open ends and electrically connected to said semiconductor element and cooperative with said hollow cylindrical member to hermetically seal said semiconductor element within the interior of said hollow cylindrical member; wherein at least one of said electrode blocks comprises a one-piece unitary structure having a truncated cone configuration having a smaller diameter end portion in direct contact with said semiconductor element and a larger diameter end portion having a diameter greater than that of said pair of open ends and disposed remote from said semiconductor element, means defining a recess within said larger diameter end portion of said electrode block, and a plurality of projections extending outwardly from the surface of said recess defining with the remainder of said one electrode block a one-piece unitary structure free of metallic interfaces therebetween; a cover member composed of electrically conductive material covering said plurality of projections and directly contacting at least some of said projections to define an electric current path from said cover member through the projections to said semiconductor element and wherein said cover member cooperates with said larger diameter end portion to define a sealed space containing therein said plurality of projections; and means for circulating a cooling medium through said sealed space and around said projections during use of the semiconductor device.
Claim 4
Dependent Claim
257 words
A semiconductor device comprising: a hollow cylindrical member composed of electrically insulating material and having a pair of open ends; a semiconductor element disposed interiorly of said hollow cylindrical member; a pair of electrode blocks each positioned in one of said pair of open ends and electrically connected to said semiconductor element and cooperative with said hollow cylindrical member to hermetically seal said semiconductor element within the interior of said hollow cylindrical member; wherein at least one of said electrode blocks comprises a one-piece unitary structure having a truncated cone configuration having a smaller diameter end portion in direct contact with said semiconductor element and a larger diameter end portion having a diameter greater than that of said pair of open ends and disposed remote from said semiconductor element, means defining a recess within said larger diameter end portion of said electrode block, and a plurality of projections extending outwardly from the surface of said recess defining with the remainder of said one electrode block a one-piece unitary structure free of metallic interfaces therebetween; a cover member composed of electrically conductive material covering said plurality of projections and directly contacting at least some of said projections to define an electric current path from said cover member through the projections to said semiconductor element and wherein said cover member cooperates with said larger diameter end portion to define a sealed space containing therein said plurality of projections; and means for circulating a cooling medium through said sealed space and around said projections during use of the semiconductor device.
Claim 5
Dependent Claim
52 words
A semiconductor device according to claim 2; including a flange connected to a peripheral portion of said smaller diameter end portion; another flange connected to said hollow cylindrical member; and means connecting together said flanges to effect a hermetic seal between said hollow cylindrical member and said at least one electrode block.
Claim 6
Dependent Claim
14 words
A semiconductor device according to claim 3; wherein said recess has a conical configuration.
Claim 7
Dependent Claim
39 words
A semiconductor device according to claim 3; wherein said plurality of projections have one of at least two different cross-sectional areas, and wherein the projections having the largest cross-sectional area are positioned at the central portion of said recess.
Claim 8
Dependent Claim
295 words
A semiconductor device according to claim 1; wherein each of said electrode blocks comprises a one-piece unitary structure having the construction of a truncated cone having a smaller diameter portion and a larger diameter portion, said smaller diameter portion extending into the associated open end portion of said hollow cylindrical member and having its end surface in contact with the adjacent one of said main faces of said semiconductor element and wherein said smaller diameter portion is provided on a peripheral surface portion thereof with a flange welded to a flange disposed on the adjacent open end of said hollow cylindrical member, and wherein said larger diameter portion has an outside diameter greater than that of the open end of said hollow cylindrical member and is positioned outside of said cylindrical member and wherein said larger diameter portion is provided at the free end thereof with means therein defining a recess and a plurality of protrusions extending outwardly from the surface of said recess, defining with the remainder of the associated electrode bLock a one-piece unitary structure free of metallic interfaces therebetween, and wherein said smaller and larger diameter portions are interconnected by a frusto-conical surface disposed therebetween; and an electrically conductive covering means cooperative with each said larger diameter portion covering said plurality of protrusions to define a sealed space containing therein said plurality of protrusions and wherein each electrically conductive covering means directly contacts at least some of said protrusions on one electrode block to define an electric current path from said covering means through the protrusions to said semiconductor element, and means defining inlet and outlet openings in each covering means for effecting circulation of a cooling medium through said sealed space and around said protrusions during use of the semiconductor device.
Claim 9
Dependent Claim
54 words
A semiconductor device according to claim 6; further including fastening means including a pair of pressure plates each coupled to an external surface portion of one of said covering means for applying a fastening force to each covering means urging them and said pair of electrode blocks toward each other to fasten same together.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-07-16 | 1977-01-15 | 1977-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-07-16 | 1981-01-15 | 1981-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-07-16 | 1985-01-15 | 1985-07-17 | $7700.00 | Window Closed / Lapsed |