US3746157A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Protective carrier for semiconductor devices
Assignee: Motorola Solutions Inc
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Filing: 1971-10-26
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Granted: 1973-07-17
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Expires: 1991-10-26
Abstract
Abstract A two-piece carrier for flat-pack integrated circuit semiconductor devices includes a nonconductive base member with a recess for the body of a semiconductor device and a plurality of lead receiving slots. A retaining clip placed over the semiconductor device has lead engaging members on each side for retaining and holding the semiconductor device in the carrier. The lead engaging members are plated with aluminum to short the leads of the semiconductor device during shipping and handling, but the retaining clip is loosely retained. When the carrier is inverted and placed on a conventional test fixture, the leads of the semiconductor device are engaged by the contacts of the test fixture and pressed onto the base member, with the retaining clip dropping away from contact with the leads.
Inventors
- 👤 T Anson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:11
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; B; B65; B65D; B65D73/00; B65D73/02
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
279 words
A carrier for semiconductor devices of the flat-pack type having a plurality of leads extending from at least one side of a package body, said carrier including in combination: a base member made of nonconductive material having a recess therein for receiving the package body of a flAt-pack semiconductor device, said base member having a support surface adjacent at least one side of the recess for supporting leads extending from such a semiconductor device, a plurality of spaced, elongated, partition members extending outwardly from said base member at right angles to the plane of the support surface, the spacing between and the width of said partition members forming channels of sufficient width to receive and separate the leads of such semiconductor package, the ends of said partition members located to expose a portion of such leads on said support surface, and retaining clip holding means in said base member; and a retaining clip having means for engaging said retaining clip holding means of said base member, said retaining clip having a recess therein for receiving the package body of a semiconductor device and having at least one lead engaging member on a side thereof overlying said support surface of said base member for engaging exposed portions of leads overlying said support surface, the location of said holding means in said base member and the position of said engaging means on said retaining clip permitting movement of said lead engaging member out of engagement with such leads with said retaining clip being retained by engagement of said engaging means with said holding means, and at least a lead engaging surface of said lead engaging member being made of conductive material.
Claim 2
Dependent Claim
279 words
A carrier for semiconductor devices of the flat-pack type having a plurality of leads extending from at least one side of a package body, said carrier including in combination: a base member made of nonconductive material having a recess therein for receiving the package body of a flAt-pack semiconductor device, said base member having a support surface adjacent at least one side of the recess for supporting leads extending from such a semiconductor device, a plurality of spaced, elongated, partition members extending outwardly from said base member at right angles to the plane of the support surface, the spacing between and the width of said partition members forming channels of sufficient width to receive and separate the leads of such semiconductor package, the ends of said partition members located to expose a portion of such leads on said support surface, and retaining clip holding means in said base member; and a retaining clip having means for engaging said retaining clip holding means of said base member, said retaining clip having a recess therein for receiving the package body of a semiconductor device and having at least one lead engaging member on a side thereof overlying said support surface of said base member for engaging exposed portions of leads overlying said support surface, the location of said holding means in said base member and the position of said engaging means on said retaining clip permitting movement of said lead engaging member out of engagement with such leads with said retaining clip being retained by engagement of said engaging means with said holding means, and at least a lead engaging surface of said lead engaging member being made of conductive material.
Claim 3
Dependent Claim
15 words
The combination according to claim 1 wherein said retaining clip is made of conductive material.
Claim 4
Dependent Claim
32 words
The combination according to claim 1 wherein said retaining clip is made of nonconductive material with the lead engaging surface of said lead engaging member being coated with a low ohmic material.
Claim 5
Dependent Claim
86 words
The combination according to claim 1 wherein the recess in said base member is an opening extending through said base member, with said base member further including spring means attached thereto and having a portion extending at least partially into the opening in said base member from a side opposite the lead support surface for engaging the package body of a semiconductor device placed in such opening and urging the leads of such semiconductor device into engagement with said lead engaging member of said retaining clip.
Claim 6
Dependent Claim
162 words
The combination according to claim 1 wherein said base member includes support surfaces on diametrically opposite sides of the recess and includes a plurality of spaced elongated partition members on opposite sides of said recess extending outwardly from said base member at right angles to the support surfaces and aligned with one another to form aligned lead receiving channels to permit said carrier to carry semiconductor devices of the flat-pack type having a plurality of leads extending from opposite sides thereof, the lead support surfaces being immediately adjacent opposite edges of the recess between the recess and said partition members on each side thereof; and said retaining clip has lead engaging members on opposite sides of the package body receiving recess therein for engaging exposed portions of leads on opposite sides of semiconductor devices on each of said support surfaces of said base member, each of said lead engaging members having at least the lead engaging surface thereof made of conductive material.
Claim 7
Dependent Claim
179 words
The combination according to claim 5 in which the recess in said base member is a substantially rectangular recess with said clip holding means comprising shoulders on the sides of the recess interconnecting said support surfaces, said retaining clip is a substantially U-shaped member made of resilient material, the base of the U including the retaining clip recess and the two sides of the U having engaging projections thereon for matingly engaging with said shoulders and wherein said lead engaging members depend from the surface of said clip having said recess along the edges of the recess at right angles to the said shoulder engaging projections, said engaging projections permitting said retaining clIp to be loosely retained in said base member with cooperation of said shoulders and said engaging projections restraining movement away from said support surface of said base member to a point further than the distance said partition members extend outwardly from said plane of said support surface while permitting clearance between leads on said support surface and the lead engaging surface of said lead engaging members.
Claim 8
Dependent Claim
27 words
The combination according to claim 6 wherein said clip is made of resilient nonconductive material with at least said lead engaging surfaces being plated with conductive material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-07-16 | 1977-01-15 | 1977-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-07-16 | 1981-01-15 | 1981-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-07-16 | 1985-01-15 | 1985-07-17 | $7700.00 | Window Closed / Lapsed |