Process for soldering difficultly solderable metals, such as si, ge, al, ti, zr and ta

Claim 2

A process for bonding a solderable material to a difficultly solderable metal having an oxidized surface which comprises; contacting said difficultly solderable metal with a solder consisting essentially of 40 - 98 wt. % Pb; 1.8 - 50 wt. % Sn; 0.05 - 10 wt. % Zn; 0.05 - 10 wt. % Sb; 0 - 0.1 wt. % Al; 0 - 0.1 wt. % Si; 0 - 0.1 wt. % Ti and 0 - 0.1 wt. % Be; while applying vibration to the portion of contact between said solder and said difficultly solderable metal to form a solder coated product, contacting said solderable material to the solder layer of said solder coated difficultly solderable metal and applying heat to the portion of contact.

Claim 3

The process of claim 3, wherein said solderable material is selected from the group consisting of: solderable metal, glass, ceramic, pottery, porcelain, refractory oxide and quartz crystal.

Claim 4

A process for bonding a metal article to a difficultly solderable metal which comprises; coating said metal article with a solder alloy consisting essentially of 40 - 98 wt. % Pb; 1.8 -50 wt. % Sn; 0.05 - 10 wt. % Zn; 0.05 - 10 wt. % Sb; 0 - 0.1 wt. % Al; 0 - 0.1 wt. % Si; 0 - 0.1 wt. % Ti and 0 - 0.1 wt. % Be, contacting the solder layer with said solder coated metal plate with a difficultly solderable metal, heating the portion of contact between said solder layer and said difficultly solderable metal, so as to melt said solder, while applying vibration to said portion of contact, solidifying said solder so as to form an adherent bond between said metal article and said difficultly solderable metal.

Claim 5

The process of claim 3 wherein said vibration is applied parallel to the soldering surface.

Claim 6

The process of claim 5 wherein the vibration is applied to the solder coated metal article.

Claim 7

The process of claim 5 wherein said vibration is applied to the difficultly solderable metal.