Method of compliant bonding
Abstract
Abstract COMPLIANT BONDING OF BEAM-LEAD DEVICES SUCH AS INTEGRATED CIRCUIT CHIPS IS ACCOMPLISHED BY ENGAGING SUCCESSIVE ONES OF THE CHIPS WITH SUCCESSIVE PORTIONS OF AN APERTURED STRIPS OF A COMPLIANT BONDING MEDIUM AND BONDING THE CHIPS TO SUCCESSIVE PORTIONS OF SUBSTRATES. A BONDING HEAD TRVELS ALONG A BONDING AXIS BOTH TO PICK UP A CHIP FROM A TRAY AND LATER TO BOND THE CHIP TO A SUBSTRATE. AFTER EACH BONDING STROKE A SPENT PORTION OF THE STRIP IS REMOVED FROM THE BONDING AXIS AND A FRESH PORTION IS INTRODUCED ONTO THE AXIS FOR THE NEXT BOND. IN ONE ILLUSTRATIVE EMBODIMENT THE BONDING HEAD IS IN THE FORM OF A ROTATABLE TURRET HAVING A NUMBER OF EQUALLY SPACED TIPS PROJECTING RADIALLY AND OUTWARDLY THEREFROM. THE STRIP IS THREADED AROUND A PORTION OF THE CIRCUMFERENCE OF THE TURRET-LIKE HEAD. AFTER EACH BOND, THE HEAD IS ROTATED UNTIL A DIFFERENT ONE OF THE TIPS AND ITS ASSOCIATED PORTION OF COMPLIANT STRIP ARE ALIGNED WITH THE BONDING AXIS. REELS ARE PROVIDED TO CONTINUOUSLY SUPPLY AND TAKEUP THE STRIP AS PROGRESSIVE ROTATION OF THE HEAD OCCURS. EACH BOND IS THUS MADE WITH AN UNSPENT PORTION OF COMPLIANT BONDING STRIP.
Inventors
- 👤 D Ludwig
Bibliographic Details
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-07-02 | 1977-01-01 | 1977-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-07-02 | 1981-01-01 | 1981-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-07-02 | 1985-01-01 | 1985-07-03 | $7700.00 | Window Closed / Lapsed |