US3740920A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for packaging hybrid circuits
Assignee: United States Department of the Air Force
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Filing: 1971-05-26
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Granted: 1973-06-26
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Expires: 1991-05-26
Abstract
Abstract A method of packaging hybrid or semi-conductor circuit by using an aluminum O-ring which when placed under compression, at an elevated temperature, between a cap or lid and the mounting surface of a silicon oxide base, undergoes a dimensional change thereby preventing the flow of adhesive from contaminating the elements in the semi-conductor compartment.
Inventors
- 👤 C Lane
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:58
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W90/00; Y; Y10; Y10T; Y10T156/00; Y10T156/10
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-06-25 | 1976-12-25 | 1977-06-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-06-25 | 1980-12-25 | 1981-06-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-06-25 | 1984-12-25 | 1985-06-26 | $7700.00 | Window Closed / Lapsed |