US3740618A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor unit and method of manufacture thereof
Assignee: BBC Brown Boveri AG Switzerland
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Filing: 1971-09-14
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Granted: 1973-06-19
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Expires: 1991-09-14
Abstract
Abstract A semiconductor unit which comprises one or more semiconductor elements in disc form assembled between two clamping members which are drawn towards each other by means of clamping bolts which pass through the clamping members and terminate in a bridging yoke. Tightening of the bolts moves the yoke in the direction of the clamping members and this movement is transmitted to one of the clamping members by way of spring means thereby to apply pressure to the semiconductor element. The spring means is provided to allow for movement of the clamping members at they heat up and expand during operation of the semiconductor unit.
Inventors
- 👤 X Vogel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 23:27
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W72/00; H10W40/625; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
203 words
A semiconductor unit comprising at least one semiconductor element in disc form, a pair of clamping members in contact respectively with opposite faces of said semiconductor disc, a plurality of clamping bolts, said bolts being parallel to each other and extending through bores provided in said clamping elements in a direction perpendicular to the plane of said semiconductor element for applying a compressive force thereto, a spring washer located on each of said bolts at one end thereof adjacent one of said clamping members, a yoke located adjacent the face of the other clamping member and which interconnects the opposite ends of said bolts, compression spring means interposed between said yoke and said other clamping member for transmitting a compressive force from said yoke through said other clamping member to said semiconductor element, and stop means interposed between said yoke and said other clamping member and which define a predetermined travel distance for said yoke in the direction of said other clamping member and a corresponding compression of said spring means, the deformation of said spring washers in the axial direction of said bolts between an initial unstressed state and a flattened state being equal to the said travel distance of said yoke.
Claim 2
Dependent Claim
203 words
A semiconductor unit comprising at least one semiconductor element in disc form, a pair of clamping members in contact respectively with opposite faces of said semiconductor disc, a plurality of clamping bolts, said bolts being parallel to each other and extending through bores provided in said clamping elements in a direction perpendicular to the plane of said semiconductor element for applying a compressive force thereto, a spring washer located on each of said bolts at one end thereof adjacent one of said clamping members, a yoke located adjacent the face of the other clamping member and which interconnects the opposite ends of said bolts, compression spring means interposed between said yoke and said other clamping member for transmitting a compressive force from said yoke through said other clamping member to said semiconductor element, and stop means interposed between said yoke and said other clamping member and which define a predetermined travel distance for said yoke in the direction of said other clamping member and a corresponding compression of said spring means, the deformation of said spring washers in the axial direction of said bolts between an initial unstressed state and a flattened state being equal to the said travel distance of said yoke.
Claim 3
Dependent Claim
83 words
A semiconductor unit as defined in claim 1 wherein said spring means is constituted by a stack of spring washers located within a sleeve set into a recess provided in said other clamping member, and wherein the end of said sleeve projecting from the face of said other clamping member constitutes said stop means which establishes the travel distance for said yoke when compressing said spring means, said sleeve and stack of spring washers being centered along the axis of said semiconductor unit.
Claim 4
Dependent Claim
123 words
A method of manufacturing a semiconductor unit as defined in claim 1 which comprises the steps of pressing and holding said yoke into engagement with said stop means against a counter action of said spring means to form with said other clamping member a sub-assembly, assembling said sub-assembly together with said semiconductor element and the remaining clamping member and said clamping bolts, tightening said clamping bolts until all axial play has been removed therefrom and the spring washers thereon are snug but not stressed, and then releasing the pressure applied to said yoke whereupon part of the compression force sTored in said spring means is released and converted into a tensional stress in said bolts resulting in a flattening of said spring washers.
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US3447118A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-06-18 | 1976-12-18 | 1977-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-06-18 | 1980-12-18 | 1981-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-06-18 | 1984-12-18 | 1985-06-19 | $7700.00 | Window Closed / Lapsed |