Heat-resistant phenolic foam compositions
Abstract
Abstract A HEAT-RESISTANT PHENOLIC FOAM COMPOSITION COMPRISING A PHENOL-ALDEHYDE FOAMABLE COMPOSITION COONTAINING A PHENOLIC RESOLE, A BORON CONTAINING COMPOUND AND AN ACID CATALYST WITH OR WITHOUT SILICIS ACID AND ALUMINUM HYDROXIDE AND/OR ALUMINUM OXIDE. THE BORON CONTAINING COMPOUNDS SPECIFICALLY SET FORTH ING THIS CASE ARE BORIC ACID OR BORID OXIDE, AND BORONPOLYOL COMPLEXES FORMED BY REACTING BORIC ACID OR BORIC OXIDE WITH A HYDDROXY ORGANIC COMPOUND OF THE GROUP COMPRISING GLYCERINE, SORBITOL, MANNITOL, OTHER SUGAR ALCOHOLS, AND ALIPHATIC DIOLS. THE ACID CATALYSTS SET FORTH HEREIN ARE PHOSPHORIC ACID, HYDROCHLORIC, AND THE COMBINATION OF PHOSPHORIC WITH TRICHLOROACETIC OR TRIFLUOROACETIC ACID WHICH ACCELERATE FOAMING WITHOUT DEGRADING HEAT RESISTANCE PROPERTIES. IN THE CASE OF THE GLASS FORMING MATERIALS OF SILICIC ACID AND ALUMINUM HYDROXIDE AND/OR ALUMINUM OXIDE, MALEIC ANHYDRIDE CAN BE USED IN PLACE OF THE ACID CATALYST.
Inventors
- 👤 H Christie
- 👤 T Byerley
Bibliographic Details
Claims Analysis
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